(module DIP-6_300mil-8_7.8x10.19mm_Pitch2.54mm (layer F.Cu) (tedit 5714085E)
  (descr "6-Lead Plastic Small Outline (SM) - Medium, 5.28 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SOIC 2.54")
  (attr smd)
  (fp_text reference REF** (at 0 -5) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value DIP-6_300mil-8_7.8x10.19mm_Pitch2.54mm (at 0 5) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -5.5 -3.9) (end -5.5 3.9) (layer F.CrtYd) (width 0.05))
  (fp_line (start 5.5 -3.9) (end 5.5 3.9) (layer F.CrtYd) (width 0.05))
  (fp_line (start -5.5 -3.9) (end 5.5 -3.9) (layer F.CrtYd) (width 0.05))
  (fp_line (start -5.5 3.9) (end 5.5 3.9) (layer F.CrtYd) (width 0.05))
  (pad 1 smd rect (at -4.605 -2.54) (size 1.7 1.5) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -4.605 0) (size 1.7 1.5) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -4.605 2.54) (size 1.7 1.5) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at 4.605 2.54) (size 1.7 1.5) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 4.605 0) (size 1.7 1.5) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 4.605 -2.54) (size 1.7 1.5) (layers F.Cu F.Paste F.Mask))
  (model Housings_SOIC.3dshapes/SOIJ-8_5.3x5.3mm_Pitch1.27mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)