******************************************************************* * * INFINEON SPICE MODEL LIBRARY for RF TRANSISTORS * * Version 2.1 * Date 2016/04/06 * * Copyright (C) 2016 by Infineon Technologies AG, Neubiberg, Germany * all rights reserved * * * This library contains the following RF Transistor models: * * BFP181 BFP620F BFP843 * BFP182W BFP640 BFP843F * BFP183 BFP640ESD BFQ19S * BFP183W BFP640F BFQ790 * BFP193 BFP640FESD BFR106 * BFP193W BFP650 BFR181W * BFP196 BFP720 BFR182 * BFP196W BFP720ESD BFR182W * BFP405 BFP720F BFR193F * BFP405F BFP720FESD BFR193W * BFP410 BFP740 BFR340F * BFP420 BFP740ESD BFR35AP * BFP420F BFP740F BFR380F * BFP450 BFP740FESD BFR740L3RH * BFP460 BFP750 BFR840L3RHESD * BFP520 BFP760 BFR843EL3 * BFP540 BFP780 BFR92P * BFP540ESD BFP840ESD BFR93A * BFP540FESD BFP840FESD BFR93AW * BFP620 BFP842ESD * ******************************************************************* .options gmin=1E-12 TNOM = 25 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP181 <<< * (C) 2013 Infineon Technologies AG * Version 2.2 April 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP181 C B E1 E2 .SUBCKT BFP181 11 22 31 32 * * CBEPAR 2 3 2.314E-013 CBCPAR 2 1 1.606E-013 CCEPAR 1 3 7.249E-014 LE 33 30 1.346E-010 LB 22 20 6.47E-011 LC 1 11 5.33E-010 CBEPCK 20 30 3E-014 CBCPCK 20 1 1E-015 CCEPCK 1 30 2.871E-013 LBI 20 2 1.594E-009 LEI 30 3 1.265E-010 * * RE1 33 31 1E-03 RE2 33 32 1E-03 * Q1 1 2 3 M_BFP181 * .MODEL M_BFP181 NPN( + TNOM = 25 + IS = 8.27E-017 + BF = 128.4 + NF = 0.9958 + VAF = 94.57 + IKF = 0.5163 + ISE = 3.852E-016 + NE = 1.699 + BR = 26.32 + NR = 0.9952 + VAR = 3 + IKR = 0.02057 + ISC = 1.353E-016 + NC = 1.098 + RB = 15.88 + IRB = 0 + RBM = 0.5682 + RE = 0.7453 + RC = 5.362 + XTB = 1 + EG = 1.1 + XTI = 8 + CJE = 3.607E-013 + VJE = 0.9 + MJE = 0.415 + TF = 1.235E-011 + XTF = 709.4 + VTF = 2.139 + ITF = 0.5259 + PTF = 0.01612 + CJC = 1.107E-013 + VJC = 0.65 + MJC = 0.415 + XCJC = 0.8 + TR = 1.0e-9 + CJS = 0 + MJS = 0.415 + VJS = 0.6 + FC = 0.9999 + KF = 0 + AF = 1.5) *************************************************************** * * .ENDS BFP181 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP182W <<< * (C) 2016 Infineon Technologies AG * Version 2.2 April 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP182W 11 22 31 32 .SUBCKT BFP182W 11 22 31 32 * CBEPAR 2 3 1.845E-013 CBCPAR 2 1 1.214E-013 CCEPAR 1 3 2.612E-013 LE 33 30 5.704E-011 LB 22 20 3.238E-010 LC 11 1 1.528E-010 CBEPCK 20 30 4.385E-014 CBCPCK 20 1 5.938E-014 CCEPCK 1 30 7.835E-014 LBI 20 2 5.789E-010 LEI 30 3 2.496E-010 * RE1 33 31 1E-03 RE2 33 32 1E-03 * Q1 1 2 3 M_BFP182W * .MODEL M_BFP182W NPN( + TNOM = 25 + IS = 1.385E-016 + BF = 116.3 + NF = 0.9927 + VAF = 59.54 + IKF = 0.1362 + ISE = 1.248E-015 + NE = 1.696 + BR = 12.93 + NR = 1.043 + VAR = 5.459 + IKR = 0.05998 + ISC = 4.797E-013 + NC = 1.7 + RB = 4.23122 + IRB = 0.0004044 + RBM = 2.86606 + RE = 0.1114 + RC = 0.2108 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 6.822E-013 + VJE = 1.29 + MJE = 0.512 + TF = 1.61578E-011 + XTF = 42.7588 + VTF = 0.207506 + ITF = 0.0531166 + PTF = 2.186 + CJC = 2.333E-013 + VJC = 0.5457 + MJC = 0.303 + XCJC = 0.1928 + TR = 6.21733E-009 + CJS = 0 + MJS = 0 + VJS = 0.4215 + FC = 0.9999 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFP182W *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP183 <<< * (C) 2013 Infineon Technologies AG * Version 2.1 March 2014 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 * BFP183 C B E1 E2 .SUBCKT BFP183 11 22 31 32 * * CBEPAR 2 3 3.545E-013 CBCPAR 2 1 2.832E-013 CCEPAR 1 3 2.011E-013 LE 33 30 1.026E-010 LB 22 20 3.288E-010 LC 1 11 5.596E-010 CBEPCK 20 30 3.624E-014 CBCPCK 20 1 2.731E-015 CCEPCK 1 30 2.011E-013 LBI 20 2 1.272E-009 LEI 30 3 2.344E-010 * * RE1 33 31 1E-03 RE2 33 32 1E-03 * Q1 1 2 3 M_BFP183 * .MODEL M_BFP183 NPN( + TNOM = 25 + IS = 2.544E-016 + BF = 113.5 + NF = 1 + VAF = 63.03 + IKF = 0.1272 + ISE = 1.556E-015 + NE = 1.759 + BR = 5.978 + NR = 1.003 + VAR = 4.361 + IKR = 0.4623 + ISC = 1E-015 + NC = 1.473 + RB = 3.834 + IRB = 0 + RBM = 0.9 + RE = 0.2246 + RC = 3.279 + XTB = 1.303 + EG = 1.1 + XTI = 8.31 + CJE = 1.055E-012 + VJE = 0.9 + MJE = 0.415 + TF = 1.387E-011 + XTF = 31.05 + VTF = 3.031 + ITF = 0.3385 + PTF = 0.0003821 + CJC = 2.868E-013 + VJC = 0.612 + MJC = 0.4365 + XCJC = 0.8098 + TR = 6.038E-008 + CJS = 0 + MJS = 0.7041 + VJS = 2.097 + FC = 0.9999 + KF = 8.931E-017 + AF = 1.512) *************************************************************** * .ENDS BFP183 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP183W <<< * (C) 2016 Infineon Technologies AG * Version 3.3 April 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 * BFP183W C B E1 E2 .SUBCKT BFP183W 11 22 31 32 * * CBEPAR 2 3 4.752E-013 CBCPAR 2 1 1.16E-013 CCEPAR 1 3 3.745E-013 LE 33 30 5.704E-011 LB 22 20 3.238E-010 LC 1 11 1.528E-010 CBEPCK 20 30 4.385E-014 CBCPCK 20 1 5.938E-014 CCEPCK 1 30 1E-015 LBI 20 2 5.789E-010 LEI 30 3 2.496E-010 * * RE1 33 31 1E-03 RE2 33 32 1E-03 * Q1 1 2 3 M_BFR183W * .MODEL M_BFR183W NPN( + TNOM = 25 + IS = 4.0555E-016 + BF = 120.16 + NF = 1.013 + VAF = 69.8779 + IKF = 1.08187 + ISE = 3.85884E-015 + NE = 1.67 + BR = 9 + NR = 0.931634 + VAR = 3.337 + IKR = 0.1093 + ISC = 1.07227E-014 + NC = 1.76405 + RB = 2.47805 + IRB = 0 + RBM = 1.74561 + RE = 0.137736 + RC = 0.1525 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 8.748E-013 + VJE = 1.196 + MJE = 0.6807 + TF = 1.40184E-011 + XTF = 16.6968 + VTF = 2.133 + ITF = 0.3481 + PTF = 0.07461 + CJC = 4.429E-013 + VJC = 0.6178 + MJC = 0.3175 + XCJC = 1 + TR = 1.7E-008 + CJS = 0 + MJS = 1 + VJS = 1 + FC = 0.9999 + KF = 8.931E-017 + AF = 1.512) *************************************************************** * .ENDS BFP183W *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP193 <<< * (C) 2016 Infineon Technologies AG * Version 3.1 March 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-15 *BFP193 C B E1 E2 .SUBCKT BFP193 11 22 31 32 CBEPAR 2 3 1.023E-012 CBCPAR 2 1 1.67E-013 CCEPAR 1 3 2.794E-013 LE 33 30 2.004E-010 LB 22 20 5.79E-010 LC 1 11 4.811E-010 CBEPCK 20 30 2.663E-014 CBCPCK 20 1 1.784E-014 CCEPCK 1 30 5.078E-015 LBI 20 2 7.03384E-010 LEI 30 3 3.26016E-010 * RE1 33 31 1E-03 RE2 33 32 1E-03 * Q1 1 2 3 M_BFP193 * .MODEL M_BFP193 NPN( + TNOM= 25 + IS = 1.264E-016 + BF = 95.69 + NF = 0.9534 + VAF = 24 + IKF = 0.4339 + ISE = 5.313E-014 + NE = 1.935 + BR = 14.27 + NR = 1.429 + VAR = 3.874 + IKR = 0.03792 + ISC = 3.741E-017 + NC = 0.9437 + RB = 1.37 + IRB = 0.0009176 + RBM = 0.8324 + RE = 0.2085 + RC = 0.1194 + XTB = 1.303 + EG = 1.09 + XTI = 6.548 + CJE = 1.762E-012 + VJE = 0.8064 + MJE = 0.434 + TF = 1.635E-011 + XTF = 7.184 + VTF = 0.06635 + ITF = 0.1963 + PTF = 0.07041 + CJC = 8.907E-013 + VJC = 0.3925 + MJC = 0.2534 + XCJC= 0.6394 + TR = 1.63E-008 + CJS = 0 + MJS = 0.99 + VJS = 1 + FC = 0.6174 + KF = 8.931E-017 + AF = 1.512) *************************************************************** * * .ENDS BFP193 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP193W <<< * (C) 2016 Infineon Technologies AG * Version 2.2 March 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-15 *BFP193W C B E1 E2 .SUBCKT BFP193W 11 22 31 32 * * CBEPAR 2 3 5.305E-013 CBCPAR 2 1 3.725E-013 CCEPAR 1 3 3.333E-013 LE 33 30 3.217E-011 LB 22 20 3.73E-011 LC 1 11 2.011E-010 CBEPCK 20 30 2E-014 CBCPCK 20 1 4E-014 CCEPCK 1 30 6E-014 LBI 20 2 7.443E-010 LEI 30 3 3.388E-010 * * RE1 33 31 1E-03 RE2 33 32 1E-03 * * Q1 1 2 3 M_BFP193W * .MODEL M_BFP193W NPN ( + TNOM= 25 + IS = 4.669E-016 + BF = 126.1 + NF = 0.9936 + VAF = 64.55 + IKF = 0.6219 + ISE = 3.166E-015 + NE = 1.767 + BR = 9 + NR = 1.025 + VAR = 3.214 + IKR = 0.075 + ISC = 8E-015 + NC = 2 + RB = 2.885 + IRB = 0 + RBM = 0.8613 + RE = 0.2616 + RC = 3.134 + XTB = 1.303 + EG = 1.09 + XTI = 6.548 + CJE = 2.221E-012 + VJE = 0.8816 + MJE = 0.3741 + TF = 1.383E-011 + XTF = 179.9 + VTF = 3.031 + ITF = 2.081 + PTF = 0.0397 + CJC = 5.633E-013 + VJC = 0.5935 + MJC = 0.3526 + XCJC= 1 + TR = 1.48E-008 + CJS = 0 + MJS = 0 + VJS = 0.7597 + FC = 0.9999 + KF = 8.931E-017 + AF = 1) *************************************************************** * * .ENDS BFP193W *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP196 <<< * (C) 2014 Infineon Technologies AG * Version 2.1 March 2014 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP196 11 22 31 32 .SUBCKT BFP196 11 22 31 32 * CBEPAR 2 3 7.236E-013 CBCPAR 2 1 5.761E-013 CCEPAR 1 3 1.43E-013 LE 33 30 2.471E-010 LB 22 20 3.37E-011 LC 11 1 4.631E-010 CBEPCK 20 30 1.5E-013 CBCPCK 20 1 3E-014 CCEPCK 1 30 1.832E-013 LBI 20 2 1.414E-009 LEI 30 3 2.766E-010 RE1 33 31 1E-03 RE2 33 32 1E-03 * Q1 1 2 3 M_BFP196 * .MODEL M_BFP196 NPN( + TNOM = 25 + IS = 9.366E-016 + BF = 107.7 + NF = 1 + VAF = 53.01 + IKF = 0.7147 + ISE = 6.616E-015 + NE = 1.888 + BR = 9.117 + NR = 1.013 + VAR = 4.377 + IKR = 0.001057 + ISC = 1.461E-014 + NC = 1.974 + RB = 5.303 + IRB = 2.424E-005 + RBM = 0.7806 + RE = 0.03041 + RC = 0.3741 + XTB = 0.8548 + EG = 1.111 + XTI = 9.516 + CJE = 3.916E-012 + VJE = 0.9 + MJE = 0.415 + TF = 1.553E-011 + XTF = 291.9 + VTF = 4 + ITF = 3.936 + PTF = 0.001 + CJC = 1E-012 + VJC = 0.6463 + MJC = 0.5166 + XCJC = 0.4567 + TR = 1E-009 + CJS = 0 + MJS = 0.4501 + VJS = 0.6 + FC = 0.509 + KF = 8.931E-017 + AF = 1.512) *************************************************************** * .ENDS BFP196 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP196W <<< * (C) 2016 Infineon Technologies AG * Version 2.2 March 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP196W C B E1 E2 .SUBCKT BFP196W 11 22 31 32 * * CBEPAR 2 3 1.2E-013 CBCPAR 2 1 7.844E-014 CCEPAR 1 3 3.498E-013 LE 33 30 1.015E-010 LB 22 20 4.236E-011 LC 1 11 2.817E-010 CBEPCK 20 30 1E-013 CBCPCK 20 1 9.69E-014 CCEPCK 1 30 8.868E-014 LBI 20 2 7.351E-010 LEI 30 3 1.754E-010 RE1 33 31 1E-03 RE2 33 32 1E-03 * Q1 1 2 3 M_BFP196W * .MODEL M_BFP196W NPN( + TNOM = 25 + IS = 8.079E-016 + BF = 116.3 + NF = 0.9936 + VAF = 32.47 + IKF = 0.436 + ISE = 8.832E-015 + NE = 1.845 + BR = 9.117 + NR = 1 + VAR = 3.152 + IKR = 0.4253 + ISC = 1.854E-014 + NC = 2 + RB = 2.151 + IRB = 0 + RBM = 0.4429 + RE = 0.1105 + RC = 0.629 + XTB = 1.303 + EG = 1.1 + XTI = 6.548 + CJE = 4.386E-012 + VJE = 0.8631 + MJE = 0.3378 + TF = 9E-012 + XTF = 12.99 + VTF = 1.823 + ITF = 0.3266 + PTF = 0.2043 + CJC = 1.45E-012 + VJC = 0.552 + MJC = 0.2504 + XCJC = 1 + TR = 1.456E-008 + CJS = 0 + MJS = 0.3753 + VJS = 0.783 + FC = 0.9999 + KF = 8.931E-017 + AF = 1.512) *************************************************************** * * .ENDS BFP196W *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP405 <<< * (C) 2012 Infineon Technologies AG * Version 2.1 January 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 555 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP405 C B E1 E2 .SUBCKT BFP405 1 2 3 4 * CBEPAR 22 33 1.122E-013 CBCPAR 22 11 4.514E-014 CCEPAR 11 33 1.61E-014 LB 22 20 6.485E-010 LE 33 30 1.968E-010 LC 11 10 6.833E-010 CBEPCK 20 30 6.219E-014 CBCPCK 20 10 7.843E-015 CCEPCK 10 30 6.427E-014 LBX 20 2 3.03E-010 LEX 30 35 6.285E-011 LCX 10 1 3.344E-010 * RSUB 55 30 39.31 RE1 35 3 1E-03 RE2 35 4 1E-03 * * Diode_sub 55 11 M_Diode_sub * Q1 11 22 33 55 M_BFP405 * .MODEL M_Diode_sub D( + IS = 2.266E-015 + N = 1.02 + RS = 60.11 + CJO = 1E-014) * .MODEL M_BFP405 NPN( + TNOM = 25 + IS = 1.222E-017 + BF = 146.8 + NF = 0.9965 + VAF = 45.14 + IKF = 0.2141 + ISE = 4.611E-015 + NE = 2 + BR = 14.57 + NR = 1 + VAR = 2.182 + IKR = 0.01198 + ISC = 1.456E-014 + NC = 2 + RB = 15.37 + IRB = 0 + RBM = 1.772 + RE = 0.9902 + RC = 3.012 + XTB = -0.1945 + EG = 1.11 + XTI = 5.65 + CJE = 3.049E-013 + VJE = 0.9695 + MJE = 0.1352 + TF = 4.857E-012 + XTF = 13.32 + VTF = 3.5 + ITF = 0.3136 + PTF = 9.485E-010 + CJC = 3.378E-014 + VJC = 0.6367 + MJC = 0.4276 + XCJC = 0.7499 + TR = 0.0009978 + CJS = 2.2E-013 + MJS = 0.2876 + VJS = 0.6442 + FC = 0.5 + KF = 7.1E-10 + AF = 2.1) *************************************************************** * .ENDS BFP405 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP405F <<< * (C) 2014 Infineon Technologies AG * Version 3.1 October 2014 *************************************************************** *.OPTION GMIN= 1.00e-12 *BFP405F 111 22 31 32 .SUBCKT BFP405F 111 22 31 32 * CBEPAR 2 3 1.298E-013 CBCPAR 2 10 3.516E-014 CCEPAR 10 3 1.546E-015 LEx 30 33 6.318E-011 LBx 20 22 3.058E-010 LCx 11 111 2.194E-010 CBEPCK 20 30 6.219E-014 CBCPCK 11 20 7.843E-015 CCEPCK 11 30 6.427E-014 LB 2 20 2.813E-010 LE 3 30 1.568E-010 LC 10 11 6.141E-010 * RE1 33 31 1E-03 RE2 33 32 1E-03 * RSub 4 30 39.31 Rcx 1 10 1 * Diode_sub 4 1 M_Diode_sub * .MODEL M_Diode_sub D( + IS = 3.5E-015 + N = 1.02 + RS = 1380 + CJO = 4E-014 + TNOM = 25) * Q1 1 2 3 4 M_BFP405F * .MODEL M_BFP405F NPN( + TNOM = 25 + IS = 9.786E-018 + BF = 122.6 + NF = 0.9944 + VAF = 55.11 + IKF = 0.17 + ISE = 2.521E-014 + NE = 2.458 + BR = 17.08 + NR = 0.9849 + VAR = 3 + IKR = 0.812 + ISC = 8.824E-017 + NC = 1.373 + RB = 28.06 + IRB = 0 + RBM = 7.073 + RE = 0.8343 + RC = 8.855 + XTB = -0.1945 + EG = 1.11 + XTI = 5.65 + CJE = 9.201E-014 + VJE = 0.9622 + MJE = 0.4628 + TF = 5.026E-012 + XTF = 710.7 + VTF = 1.631 + ITF = 2.188 + PTF = 2.329E-008 + CJC = 2.974E-014 + VJC = 0.9104 + MJC = 0.7658 + XCJC = 0.7499 + TR = 1.879E-009 + CJS = 3.298E-013 + MJS = 0.5521 + VJS = 2 + FC = 0.5 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFP405F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP410 <<< * (C) 2014 Infineon Technologies AG * Version 3.1 October 2014 *************************************************************** *.OPTION GMIN= 1.00e-12 *BFP410 111 22 31 32 .SUBCKT BFP410 111 22 31 32 * CBEPAR 2 3 3.07788E-013 CBCPAR 2 10 6.2793E-014 CCEPAR 10 3 1.12531E-013 LEx 30 33 1.67697E-020 LBx 20 22 6.71048E-010 LCx 11 111 8.80072E-010 CBEPCK 20 30 6.219E-014 CBCPCK 11 20 7.843E-015 CCEPCK 11 30 6.427E-014 LB 2 20 3.23461E-010 LE 3 30 2.21759E-010 LC 10 11 2.45831E-010 * RE1 33 31 1E-03 RE2 33 32 1E-03 * RSub 4 30 260 Rcx 1 10 1 * Diode_sub 4 1 M_Diode_sub * .MODEL M_Diode_sub D( + IS = 6.662E-016 + N = 0.9692 + RS = 1380 + CJO = 4E-014 + TNOM = 25) * Q1 1 2 3 4 M_BFP410 * .MODEL M_BFP410 NPN( + TNOM = 25 + IS = 1.899E-017 + BF = 105.8 + NF = 0.9951 + VAF = 55.11 + IKF = 0.4494 + ISE = 7.029E-014 + NE = 2.811 + BR = 43.41 + NR = 0.9714 + VAR = 3.56 + IKR = 0.002084 + ISC = 1.441E-018 + NC = 20.56 + RB = 13.87 + IRB = 0 + RBM = 7.073 + RE = 0.3799 + RC = 4.224 + XTB = -0.1945 + EG = 1.11 + XTI = 5.65 + CJE = 2.2012E-013 + VJE = 0.16 + MJE = 0.0865484 + TF = 4.42467E-012 + XTF = 17.2841 + VTF = 5.80018 + ITF = 0.611742 + PTF = 3.535E-008 + CJC = 5.36125E-014 + VJC = 1.20092 + MJC = 0.15027 + XCJC = 0.7499 + TR = 1.396E-009 + CJS = 1.33653E-013 + MJS = 0.275519 + VJS = 0.78109 + FC = 0.5 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFP410 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP420 <<< * (C) 2012 Infineon Technologies AG * Version 2.1 January 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 260 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP420 C B E1 E2 .SUBCKT BFP420 1 2 3 4 * CBEPAR 22 33 5.592E-014 CBCPAR 22 11 1.143E-013 CCEPAR 11 33 1.596E-013 LB 22 20 7.42E-010 LE 33 30 1.656E-010 LC 11 10 7.7E-010 CBEPCK 20 30 4.741E-014 CBCPCK 20 10 1.135E-015 CCEPCK 10 30 4.48E-014 LBX 20 2 2.339E-010 LEX 30 35 4.189E-011 LCX 10 1 2.243E-010 * RE1 35 3 1E-03 RE2 35 4 1E-03 RSub 55 33 176.4 * Diode_sub 55 11 M_Diode_sub * Q1 11 22 33 55 M_BFP420 * .MODEL M_Diode_sub D( + IS = 4.356E-015 + N = 1.02 + RS = 0.1 + CJO = 4E-014 + TNOM = 25) * .MODEL M_BFP420 NPN( + TNOM = 25 + IS = 3.753E-017 + BF = 140.8 + NF = 0.9996 + VAF = 59.18 + IKF = 0.6604 + ISE = 1E-014 + NE = 2 + BR = 13.61 + NR = 0.9938 + VAR = 2.685 + IKR = 0.007013 + ISC = 3.49E-016 + NC = 1.5 + RB = 11.99 + IRB = 0 + RBM = 1.521 + RE = 0.3062 + RC = 2.152 + XTB = 0.1187 + EG = 1.11 + XTI = 4.162 + CJE = 5.621E-013 + VJE = 0.4892 + MJE = 0.2565 + TF = 4.83855E-012 + XTF = 6.245 + VTF = 10.66 + ITF = 0.5436 + PTF = 0 + CJC = 1.227E-013 + VJC = 0.8453 + MJC = 0.6803 + XCJC = 0.7 + TR = 4.7E-009 + CJS = 4.757E-013 + MJS = 1 + VJS = 0.5323 + FC = 0.4148 + KF = 65.9E-12 + AF = 2.0) *************************************************************** * .ENDS BFP420 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP420F <<< * (C) 2011 Infineon Technologies AG * Version 2.1 August 2011 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 240 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP420F C B E1 E2 .SUBCKT BFP420F 1 2 3 4 * CBEPAR 22 33 6.84421E-014 CBCPAR 22 11 1.04791E-013 CCEPAR 11 33 1.08422E-014 LB 22 20 5.76616E-010 LE 33 30 2.74191E-010 LC 11 10 5.5524E-010 CBEPCK 20 30 4.64908E-014 CBCPCK 20 10 1.764E-015 CCEPCK 10 30 3.98512E-014 LBX 20 2 8.07664E-011 LEX 30 35 4.936E-011 LCX 10 1 7.26419E-011 * RS 55 30 13.05 RE1 35 3 1E-03 RE2 35 4 1E-03 * Diode_sub 55 11 M_Diode_sub * Q1 11 22 33 55 M_BFP420F * .MODEL M_Diode_sub D( + IS = 4.356E-015 + N = 1.02 + RS = 0.1 + CJO = 4E-014 + TNOM = 25) * .MODEL M_BFP420F NPN( + TNOM = 25 + IS = 3.753E-017 + BF = 127.8 + NF = 0.9969 + VAF = 59.18 + IKF = 0.6604 + ISE = 2.064E-013 + NE = 2.593 + BR = 13.61 + NR = 1.009 + VAR = 2.685 + IKR = 0.007013 + ISC = 3.49E-016 + NC = 1.5 + RB = 7.236 + IRB = 0 + RBM = 1.521 + RE = 0.3062 + RC = 2.152 + XTB = 0.1187 + EG = 1.11 + XTI = 4.162 + CJE = 5.62122E-013 + VJE = 0.489194 + MJE = 0.2565 + TF = 4.49302E-012 + XTF = 6.24451 + VTF = 10.658 + ITF = 0.543638 + PTF = 0 + CJC = 1.2273E-013 + VJC = 0.8453 + MJC = 0.6803 + XCJC = 0.7 + TR = 4.7E-009 + CJS = 4.75722E-013 + MJS = 1 + VJS = 0.532348 + FC = 0.4148 + KF = 4.677E-011 + AF = 1.966) *************************************************************** * .ENDS BFP420F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 15 GHZ * >>> BFP450 <<< * (C) 2010 Infineon Technologies AG * Version 1.1 November 2010 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 450 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP450FESD C B E .SUBCKT BFP450 1 2 3 4 * * CBEPAR 22 33 1.20132E-013 CBCPAR 22 11 3.02378E-013 CCEPAR 11 33 3.69684E-017 LB 22 20 9.04235E-010 LE 33 30 2.03283E-010 LC 11 10 2.12462E-010 CBEPCK 20 30 1.10618E-014 CBCPCK 20 10 2.51536E-014 CCEPCK 10 30 2.24704E-013 LBX 20 2 1.18397E-012 LEX 30 333 2.31137E-013 LCX 10 1 7.74176E-010 RSUB 30 44 260 * RE1 33 3 1E-03 RE2 33 4 1E-03 * Q1 11 22 33 44 M_BFP450 * .MODEL M_BFP450 NPN( + TNOM = 25 + IS = 1.21E-016 + BF = 112.3 + NF = 1 + VAF = 46.19 + IKF = 1.005 + ISE = 2.427E-014 + NE = 2 + BR = 4.66 + NR = 1 + VAR = 3.604 + IKR = 0.1924 + ISC = 3.85E-015 + NC = 1.5 + RB = 3.193 + IRB = 0 + RBM = 2.725 + RE = 0.09391 + RC = 1.578 + XTB = 0.04525 + EG = 1.12 + XTI = 4.267 + CJE = 1.777E-012 + VJE = 0.7811 + MJE = 0.39 + TF = 4.125E-012 + XTF = 8.008 + VTF = 4.189 + ITF = 1.889 + PTF = 0.1 + CJC = 5.069E-013 + VJC = 0.6403 + MJC = 0.31 + XCJC = 0.7031 + TR = 4.163E-009 + CJS = 1.66361E-012 + MJS = 0.154738 + VJS = 0.2526 + FC = 0.5 + KF = 5.5e-12 + AF = 1.99) *************************************************************** * * .ENDS BFP450 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP460 <<< * (C) 2011 Infineon Technologies AG * Version 2.1 december 2011 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 250 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP460 C B E1 E2 .SUBCKT BFP460 1 2 3 4 * CBEPAR 22 33 1.28143E-013 CBCPAR 22 11 1.442E-013 CCEPAR 11 33 1.57251E-013 LB 22 20 8.19879E-010 LE 33 30 2.70643E-010 CBEPCK 20 30 7.159E-014 CBCPCK 20 11 1E-015 CCEPCK 11 30 6.715E-014 LBx 20 2 4.08478E-010 LEx 30 35 3.12844E-011 LCx 11 1 3.97005E-010 * RE1 35 3 1E-03 RE2 35 4 1E-03 * Q1 11 22 33 M_BFP460 * .MODEL M_BFP460 NPN( + TNOM = 25 + IS = 1.221E-016 + BF = 187.3 + NF = 1.005 + VAF = 37.95 + IKF = 0.5364 + ISE = 6.757E-014 + NE = 2.312 + BR = 14.19 + NR = 1.004 + VAR = 2.455 + IKR = 0.0866 + ISC = 1.335E-015 + NC = 1.5 + RB = 12.3172 + IRB = 0 + RBM = 1.73939 + RE = 0.2919 + RC = 2.88488 + XTB = -2.2 + EG = 1.11 + XTI = 0.91 + CJE = 3.967E-013 + VJE = 0.4605 + MJE = 0.4485 + TF = 4.46543E-012 + XTF = 18.02 + VTF = 3.248 + ITF = 0.8641 + PTF = 0.1 + CJC = 2.777E-013 + VJC = 0.6477 + MJC = 0.2943 + XCJC = 0.7031 + TR = 2.703E-006 + CJS = 0 + MJS = 1 + VJS = 1 + FC = 0.5 + KF = 2.9E-13 + AF = 1.4) *************************************************************** * * .ENDS BFP460 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 15 GHZ * >>> BFP520 <<< * (C) 2011 Infineon Technologies AG * Version 2.1 November 2011 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 450 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP520 C B E1 E2 .SUBCKT BFP520 1 2 3 4 * CBEPAR 22 33 1.497E-013 CBCPAR 22 11 4.3E-014 CCEPAR 11 33 8.422E-014 LB 22 20 6.709E-010 LE 33 30 1.362E-010 LC 11 10 6.418E-010 CBEPCK 20 30 8.253E-014 CBCPCK 20 10 5E-015 CCEPCK 10 30 7.183E-014 LBX 20 2 2.153E-010 LEX 30 35 7.038E-011 LCX 10 1 2.211E-010 * RSub 55 30 118 RE1 35 3 1E-03 RE2 35 4 1E-03 * Diode_sub 55 11 M_Diode_sub * Q1 11 22 33 55 M_BFP520 * .MODEL M_Diode_sub D( + IS = 1.21E-015 + N = 0.9907 + RS = 1 + CJO = 1E-014 + TNOM = 25) * .MODEL M_BFP520 NPN( + TNOM = 25 + IS = 1.154E-017 + BF = 180.9 + NF = 1 + VAF = 52.37 + IKF = 0.1889 + ISE = 9.989E-015 + NE = 1.981 + BR = 30.56 + NR = 0.9348 + VAR = 2.617 + IKR = 0.00999 + ISC = 2.021E-013 + NC = 2 + RB = 15.87 + IRB = 0 + RBM = 4.337 + RE = 0.6815 + RC = 5.635 + XTB = -0.2 + EG = 1.11 + XTI = 4.59 + CJE = 1.411E-013 + VJE = 1.214 + MJE = 0.5074 + TF = 2.19E-012 + XTF = 7.8 + VTF = 7.74 + ITF = 0.579 + PTF = 4.441E-015 + CJC = 5.463E-014 + VJC = 0.7359 + MJC = 0.4654 + XCJC = 0.8343 + TR = 5.457E-010 + CJS = 2.61E-013 + MJS = 0.2568 + VJS = 0.6947 + FC = 0.7902 + KF = 5.4E-011 + AF = 1.814) *************************************************************** * .ENDS BFP520 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP540 <<< * (C) 2011 Infineon Technologies AG * Version 2.1 November 2011 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 290 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * 0°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP540 C B E1 E2 .SUBCKT BFP540 1 2 3 4 * CBEPAR 22 33 3.19737E-013 CBCPAR 22 11 1.45578E-013 CCEPAR 11 33 3.31838E-014 LB 22 20 7.1E-010 LE 33 30 1.73226E-010 LC 11 10 5.45033E-010 CBEPCK 20 30 9.99916E-014 CBCPCK 20 10 1.00897E-015 CCEPCK 10 30 9.96469E-014 LBX 20 2 3.46463E-010 LEX 30 35 6.02121E-011 LCX 10 1 3.89864E-010 * RS 55 30 82.8307 RE1 35 3 1E-03 RE2 35 4 1E-03 * Diode_sub 55 11 M_Diode_sub * Q1 11 22 33 55 M_BFP540 * .MODEL M_Diode_sub D( + IS = 5.132E-016 + N = 1 + RS = 400 + CJO = 4E-014 + TNOM = 25) * .MODEL M_BFP540 NPN( + TNOM = 25 + IS = 6.79E-017 + BF = 205.5 + NF = 1 + VAF = 46.19 + IKF = 0.5278 + ISE = 3.946E-014 + NE = 2 + BR = 4.66 + NR = 1 + VAR = 1.843 + IKR = 0.1924 + ISC = 3.85E-015 + NC = 1.5 + RB = 13.9992 + IRB = 0 + RBM = 2.234 + RE = 0.1699 + RC = 2.484 + XTB = -1.003 + EG = 1.11 + XTI = 2.786 + CJE = 3.354E-013 + VJE = 1.453 + MJE = 0.8833 + TF = 3.624E-012 + XTF = 5.037 + VTF = 3.248 + ITF = 0.7287 + PTF = 0.1 + CJC = 6.349E-014 + VJC = 0.8371 + MJC = 0.9968 + XCJC = 0.7031 + TR = 4.163E-009 + CJS = 4.19E-013 + MJS = 0.164 + VJS = 0.1689 + FC = 0.6027 + KF = 18.9E-011 + AF = 2.01) *************************************************************** * .ENDS BFP540 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP540ESD <<< * (C) 2011 Infineon Technologies AG * Version 2.1 November 2011 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 290 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * 0°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP540ESD C B E1 E2 .SUBCKT BFP540ESD 1 2 3 4 * CBEPAR 22 33 3.19737E-013 CBCPAR 22 11 1.45578E-013 CCEPAR 11 33 3.31838E-014 LB 22 20 7.1E-010 LE 33 30 1.73226E-010 LC 11 10 5.45033E-010 CBEPCK 20 30 9.99916E-014 CBCPCK 20 10 1.00897E-015 CCEPCK 10 30 9.96469E-014 LBX 20 2 3.46463E-010 LEX 30 35 6.02121E-011 LCX 10 1 3.89864E-010 * RS 55 30 82.8307 RE1 35 3 1E-03 RE2 35 4 1E-03 * Diode_sub 55 11 M_Diode_sub * Q1 11 22 33 55 M_BFP540ESD * .MODEL M_Diode_sub D( + IS = 5.132E-016 + N = 1 + RS = 400 + CJO = 4E-014 + TNOM = 25) * .MODEL M_BFP540ESD NPN( + TNOM = 25 + IS = 6.79E-017 + BF = 205.5 + NF = 1 + VAF = 46.19 + IKF = 0.5278 + ISE = 3.946E-014 + NE = 2 + BR = 4.66 + NR = 1 + VAR = 1.843 + IKR = 0.1924 + ISC = 3.85E-015 + NC = 1.5 + RB = 13.9992 + IRB = 0 + RBM = 2.234 + RE = 0.1699 + RC = 2.484 + XTB = -1.003 + EG = 1.11 + XTI = 2.786 + CJE = 3.354E-013 + VJE = 1.453 + MJE = 0.8833 + TF = 3.624E-012 + XTF = 5.037 + VTF = 3.248 + ITF = 0.7287 + PTF = 0.1 + CJC = 6.349E-014 + VJC = 0.8371 + MJC = 0.9968 + XCJC = 0.7031 + TR = 4.163E-009 + CJS = 4.19E-013 + MJS = 0.164 + VJS = 0.1689 + FC = 0.6027 + KF = 18.9E-011 + AF = 2.01) *************************************************************** * .ENDS BFP540ESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 8 GHZ * >>> BFP540FESD <<< * (C) 2012 Infineon Technologies AG * Version 2.1 January 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 280 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 * BFP540FESD C B E1 E2 .SUBCKT BFP540FESD 1 2 3 4 * CBEPAR 22 33 3.758E-013 CBCPAR 22 11 1.32003E-013 CCEPAR 11 33 4.41012E-014 LB 22 20 5.25538E-010 LE 33 30 1.7602E-010 LC 11 10 4.1569E-010 CBEPCK 20 30 3.3795E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 3.04416E-014 LBX 20 2 1.69782E-010 LEX 30 35 7.67852E-011 LCX 10 1 1.63982E-010 * RS 55 33 91.8342 RE1 35 3 1E-03 RE2 35 4 1E-03 * Diode_sub 55 11 M_Diode_sub Q1 11 22 33 55 M_BFP540FESD * .MODEL M_Diode_sub D( + IS = 5.566E-015 + N = 1 + RS = 400 + CJO = 9.14809E-014) * .MODEL M_BFP540FESD NPN( + TNOM = 25 + IS = 6.79E-017 + BF = 205.5 + NF = 1 + VAF = 46.19 + IKF = 0.5278 + ISE = 3.946E-014 + NE = 2 + BR = 4.66 + NR = 1 + VAR = 1.843 + IKR = 0.1924 + ISC = 3.85E-015 + NC = 1.5 + RB = 17.6828 + IRB = 0 + RBM = 2.234 + RE = 0.1699 + RC = 2.484 + XTB = -1.003 + EG = 1.11 + XTI = 2.786 + CJE = 3.354E-013 + VJE = 1.453 + MJE = 0.8833 + TF = 3.77825E-012 + XTF = 5.037 + VTF = 6.92041 + ITF = 0.719327 + PTF = 0.1 + CJC = 6.349E-014 + VJC = 0.8371 + MJC = 0.9968 + XCJC = 0.7031 + TR = 4.163E-009 + CJS = 4.19E-013 + MJS = 0.164 + VJS = 0.1689 + FC = 0.6027 + KF = 8.9E-011 + AF = 2) *************************************************************** * .ENDS BFP540FESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP620 <<< * (C) 2014 Infineon Technologies AG * Version 3.1 Oktober 2014 *************************************************************** *.OPTION GMIN= 1.00e-12 *BFP620 C B E1 E2 .SUBCKT BFP620 111 22 31 32 * CBEPAR 2 3 1.61E-014 CBCPAR 2 10 9.206E-014 CCEPAR 10 3 4.783E-014 LEx 30 33 2.103E-012 LBx 20 22 4.68E-010 LCx 11 111 3.153E-010 CBEPCK 20 30 7.147E-014 CBCPCK 11 20 4.512E-016 CCEPCK 11 30 1.305E-013 LB 2 20 5.692E-010 LE 3 30 2.255E-010 LC 10 11 6.581E-010 * RE1 33 31 1E-03 RE2 33 32 1E-03 * RSub 4 30 260 Rcx 1 10 1.449 * Diode_sub 4 1 M_Diode_sub * .MODEL M_Diode_sub D( + IS = 2.16E-014 + N = 1.123 + RS = 0.1 + CJO = 4E-014 + TNOM = 25) * Q1 1 2 3 4 M_BFP620 * .MODEL M_BFP620 NPN( + TNOM = 25 + IS = 2.057E-015 + BF = 1148 + NF = 1.008 + VAF = 355.5 + IKF = 0.2022 + ISE = 2.675E-013 + NE = 2.946 + BR = 309.1 + NR = 0.9849 + VAR = 1.204 + IKR = 0.005842 + ISC = 1E-017 + NC = 7.2 + RB = 8.533 + IRB = 0.0007035 + RBM = 3.31 + RE = 0.02592 + RC = 2.429 + XTB = -2.482 + EG = 1.034 + XTI = 0.808 + CJE = 4.356E-013 + VJE = 0.337 + MJE = 0.004858 + TF = 1.4E-012 + XTF = 1.466 + VTF = 3.079 + ITF = 2.083 + PTF = 8.82E-016 + CJC = 9.958E-014 + VJC = 1.68 + MJC = 1.715 + XCJC = 0.6466 + TR = 1E-009 + CJS = 8.583E-014 + MJS = 0.1744 + VJS = 0.1542 + FC = 0.8156 + KF = 2.56E-011 + AF = 1.798) *************************************************************** * * .ENDS BFP620 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP620F <<< * (C) 2014 Infineon Technologies AG * Version 2.1 Oktober 2014 *************************************************************** *.OPTION GMIN= 1.00e-12 *BFP620F 111 22 31 32 .SUBCKT BFP620F 111 22 31 32 * CBEPAR 2 3 4.4739E-013 CBCPAR 2 10 4.27507E-014 CCEPAR 10 3 4.78735E-015 LEx 30 33 2.36732E-011 LBx 20 22 1.51076E-014 LCx 11 111 2.698E-014 CBEPCK 20 30 5.065E-014 CBCPCK 11 20 5E-015 CCEPCK 11 30 1.844E-014 LB 2 20 6.7218E-010 LE 3 30 2.38369E-010 LC 10 11 4.2493E-010 * RE1 33 31 1E-03 RE2 33 32 1E-03 * RSub 4 30 260 Rcx 1 10 0.98758 * Diode_sub 4 1 M_Diode_sub * .MODEL M_Diode_sub D( + IS = 4.72872E-015 + N = 1.00535 + RS = 1380 + CJO = 4E-014 + TNOM = 25) * Q1 1 2 3 4 M_BFP620F * .MODEL M_BFP620F NPN( + TNOM = 25 + IS = 2.43538E-015 + BF = 1210.87 + NF = 1.00765 + VAF = 711 + IKF = 0.671822 + ISE = 2.10616E-014 + NE = 1.95899 + BR = 454.082 + NR = 1.00153 + VAR = 1.04564 + IKR = 0.00337819 + ISC = 3.2132E-016 + NC = 1.498 + RB = 21 + IRB = 0.0007035 + RBM = 10 + RE = 0.159079 + RC = 1.3582 + XTB = -2.48 + EG = 1.1 + XTI = 0.808 + CJE = 1.97957E-014 + VJE = 0.365329 + MJE = 0.252139 + TF = 1.04936E-012 + XTF = 0.003926 + VTF = 1.517 + ITF = 1.38779 + PTF = 4.342E-017 + CJC = 1.64596E-013 + VJC = 0.715467 + MJC = 0.474119 + XCJC = 0.646 + TR = 4.595E-009 + CJS = 2.65932E-014 + MJS = 2.99989 + VJS = 0.4006 + FC = 0.815 + KF = 2.56E-011 + AF = 1.798) *************************************************************** * * .ENDS BFP620F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP640 <<< * (C) 2013 Infineon Technologies AG * Version 2.1 April 2013 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 300 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP640 C B E1 E2 .SUBCKT BFP640 1 2 3 4 * * CBEPAR 22 33 8.577E-014 CBCPAR 22 11 8.597E-014 CCEPAR 11 33 1E-015 LE 33 30 1.41072E-010 LB 22 20 6.76541E-010 LC 11 10 4.8003E-010 CBEPCK 20 30 4E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 4E-014 LBX 20 2 2.7E-010 LEX 30 35 8.971E-011 LCX 10 1 2.7E-010 * RSUB 55 30 260 Rcx 111 11 4.467 * D1 55 111 M_D1 * RE1 35 3 1E-03 RE2 35 4 1E-03 * .MODEL M_D1 D( + IS=8.005E-015 + N=1.02 + RS=0.1 + CJO=4E-014) * Q1 111 22 33 55 M_BFP640 * .MODEL M_BFP640 NPN( + TNOM = 25 + IS = 1.239E-015 + BF = 887.6 + NF = 1 + VAF = 1000 + IKF = 0.1433 + ISE = 1E-014 + NE = 2 + BR = 148.3 + NR = 1 + VAR = 1.202 + IKR = 0.01 + ISC = 2.948E-015 + NC = 2 + RB = 5.016 + IRB = 0 + RBM = 1.977 + RE = 0.3592 + RC = 2.953 + XTB = -2.576 + EG = 1.09 + XTI = 0.15 + CJE = 4.58707E-013 + VJE = 1.76884 + MJE = 0.164326 + TF = 2.13534E-012 + XTF = 1 + VTF = 0.03 + ITF = 2 + PTF = 0.1 + CJC = 6.62237E-014 + VJC = 0.936235 + MJC = 1.16702 + XCJC = 1 + TR = 1E-009 + CJS = 1.20379E-013 + MJS = 0.3 + VJS = 1 + FC = 0.5 + KF = 1.981E-012 + AF = 1.552) *************************************************************** * .ENDS BFP640 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP640ESD <<< * (C) 2012 Infineon Technologies AG * Version 2.1 November 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 310 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP640ESD C B E1 E2 .SUBCKT BFP640ESD 1 2 3 4 * CBEPAR 22 33 2.29E-013 CBCPAR 22 11 7.095E-014 CCEPAR 11 33 2.024E-013 LB 22 20 6.623E-010 LE 33 30 1.519E-010 LC 11 10 6.522E-010 CBEPCK 20 30 4.4E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 4.4E-014 LBX 20 2 3.607E-010 LEX 30 35 5.524E-011 LCX 10 1 2.452E-010 * RE1 35 3 1E-03 RE2 35 4 1E-03 * D1 33 25 M_D1 D2 41 25 M_D2 * RBLfdb 22 25 1.754 * R_PW_fbd 41 33 7.5 R_PW_e11g 42 33 2.1 R_sub_fbd 41 5 477 R_sub_e11g 42 5 350 R_CS_npn 55 5 424.1 RSUB 30 5 0.001 * D3 42 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * RLDNBL 15 11 10.63 * Q1 11 22 33 55 M_BFP640ESD * .MODEL M_D1 D( + IS=3.5E-015 + N=1 + RS=6.1 + CJO=1E-014) * .MODEL M_D2 D( + IS=6E-015 + N=1 + RS=0.01 + CJO=9E-015) * .MODEL M_D3 D( + IS=9E-015 + N=0.9973 + RS=160 + CJO =2E-014) * .MODEL M_D4 D( + IS=3.5E-015 + N=1 + RS=0.2 + CJO =2E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3.003E-014) * * .MODEL M_BFP640ESD NPN( + TNOM = 25 + IS = 9.658E-016 + BF = 557.2 + NF = 1 + VAF = 192.2 + IKF = 0.09128 + ISE = 3.626E-014 + NE = 2 + BR = 246.5 + NR = 0.9955 + VAR = 1.577 + IKR = 0.004397 + ISC = 1.27E-014 + NC = 1.322 + RB = 4.406 + IRB = 0.0006534 + RBM = 0.8094 + RE = 0.2638 + RC = 4.042 + XTB = -2.576 + EG = 1.11 + XTI = 0.15 + CJE = 3.798E-013 + VJE = 1 + MJE = 0.1016 + TF = 2.172E-012 + XTF = 1.084 + VTF = 0.5626 + ITF = 0.3839 + PTF = 0.28 + CJC = 5.346E-014 + VJC = 0.7186 + MJC = 0.8649 + XCJC = 1 + TR = 2E-009 + CJS = 1.404E-013 + MJS = 0.07264 + VJS = 0.4 + FC = 0.3 + KF = 7.116E-011 + AF = 1.7) *************************************************************** .ENDS BFP640ESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFP640F <<< * (C) 2013 Infineon Technologies AG * Version 1.1 April 2013 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 290 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP640F C B E1 E2 .SUBCKT BFP640F 1 2 3 4 * * CBEPAR 22 33 3.22079E-014 CBCPAR 22 11 7.89594E-014 CCEPAR 11 33 1E-015 LE 33 30 2.1E-010 LB 22 20 4.38378E-010 LC 11 10 5.25411E-010 K_BC LB LC 0.2398 K_EB LE LB 0.1 K_EC LE LC 0.1 CBEPCK 20 30 3E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 3E-014 LBX 20 2 2E-010 LEX 30 35 5E-011 LCX 10 1 2E-010 * RSUB 55 30 260 Rcx 111 11 4.467 * D1 55 111 M_D1 * RE1 35 3 1E-03 RE2 35 4 1E-03 * .MODEL M_D1 D( + IS=8.005E-015 + N=1.02 + RS=0.1 + CJO=4E-014) * Q1 111 22 33 55 M_BFP640F * .MODEL M_BFP640F NPN( + TNOM = 25 + IS = 1.239E-015 + BF = 887.6 + NF = 1 + VAF = 1000 + IKF = 0.1433 + ISE = 1E-014 + NE = 2 + BR = 148.3 + NR = 1 + VAR = 1.202 + IKR = 0.01 + ISC = 2.948E-015 + NC = 2 + RB = 5.016 + IRB = 0 + RBM = 1.977 + RE = 0.3592 + RC = 2.953 + XTB = -2.514 + EG = 1.09 + XTI = 0.808 + CJE = 4.587E-013 + VJE = 1.769 + MJE = 0.1643 + TF = 2.04121E-012 + XTF = 1 + VTF = 0.03 + ITF = 2 + PTF = 0.1 + CJC = 6.622E-014 + VJC = 0.9362 + MJC = 1.167 + XCJC = 1 + TR = 1E-009 + CJS = 1.204E-013 + MJS = 0.3 + VJS = 1 + FC = 0.5 + KF = 9.35597E-013 + AF = 1.32796) *************************************************************** * .ENDS BFP640F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP640FESD <<< * (C) 2010 Infineon Technologies AG * Version 1.1 April 2016 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 300 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP640FESD C B E1 E2 .SUBCKT BFP640FESD 1 2 31 32 * * CBEPAR 22 33 3.13946E-013 CBCPAR 22 11 2.787E-014 CCEPAR 11 33 3.39308E-015 LB 22 20 5.04561E-010 LE 33 30 9.88791E-011 LC 11 10 5.104E-010 CBEPCK 20 30 5.49758E-014 CBCPCK 20 10 8.469E-015 CCEPCK 10 30 1.00975E-014 LBX 20 2 4.005E-011 LEX 30 3 4.176E-011 LCX 10 1 2.07E-011 * * D1 33 25 M_D1 D2 26 25 M_D2 RBLfdb 22 25 3.2 RPWf 33 26 7.64 RPWe 33 16 11.27 RSf 26 4 477 RSe 16 4 350 RCs 44 4 0.26 RSUB 30 4 1.00e-12 D3 16 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 RLDNBL 15 11 14.8 * RE1 3 31 1E-03 RE2 3 32 1E-03 * * Q1 11 22 33 44 M_BFP640FESD * * .MODEL M_D1 D( + IS=3.5E-015 + N=1.02 + RS=6.1 + CJO=2E-014) * * .MODEL M_D2 D( + IS=3.5E-015 + N=1.02 + RS=0 + CJO=2.25E-014) * * .MODEL M_D3 D( + IS=3.5E-015 + N=1.02 + RS=0 + CJO =9.57E-014) * * .MODEL M_D4 D( + IS=3.5E-015 + N=1.02 + RS=0.2 + CJO =3E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014) * * * * .MODEL M_BFP640FESD NPN( + TNOM = 25 + IS = 1.542E-015 + BF = 642.6 + NF = 1.014 + VAF = 355.5 + IKF = 0.1782 + ISE = 3.98E-015 + NE = 1.737 + BR = 49.18 + NR = 0.98 + VAR = 1.378 + IKR = 0.1924 + ISC = 3.85E-015 + NC = 1.5 + RB = 6.00965 + IRB = 9.099E-006 + RBM = 1.74736 + RE = 0.0142 + RC = 4.54 + XTB = -2.514 + EG = 1.11 + XTI = 0.808 + CJE = 1.676E-013 + VJE = 0.6804 + MJE = 0.2508 + TF = 1.836E-012 + XTF = 2.279 + VTF = 0.9972 + ITF = 0.6365 + PTF = 0.2896 + CJC = 8.39234E-014 + VJC = 0.5464 + MJC = 0.3098 + XCJC = 0.6466 + TR = 1.489E-007 + CJS = 2.15519E-013 + MJS = 0.2426 + VJS = 0.29 + FC = 0.8156 + KF = 123.5E-12 + AF = 1.89) *************************************************************** * * .ENDS BFP640FESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 15 GHZ * >>> BFP650 <<< * (C) 2012 Infineon Technologies AG * Version 2.1 January 2012 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the temperature increment caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 140 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP650 C B E1 E2 .SUBCKT BFP650 1 2 3 4 * CBEPAR 22 33 1.251E-012 CBCPAR 22 11 2.098E-013 CCEPAR 11 33 8.929E-014 LB 22 20 6.42975E-010 LE 33 30 2.00713E-010 LC 11 10 7.19229E-010 CBEPCK 20 30 8.352E-014 CBCPCK 20 10 1.31927E-015 CCEPCK 10 30 9.42707E-014 LBX 20 2 3.95979E-010 LEX 30 35 3.49243E-011 LCX 10 1 2.37233E-010 * RSub 55 30 451.803 RE1 35 3 1E-03 RE2 35 4 1E-03 * Q1 11 22 33 55 M_BFP650 * .MODEL M_BFP650 NPN( + TNOM = 25 + IS = 4.379E-015 + BF = 546.3 + NF = 1.02 + VAF = 149.9 + IKF = 0.1673 + ISE = 5.486E-014 + NE = 2 + BR = 185.8 + NR = 1 + VAR = 1.816 + IKR = 0.01136 + ISC = 6.651E-015 + NC = 1.5 + RB = 6.376 + IRB = 8.075E-005 + RBM = 0.01719 + RE = 0.294 + RC = 2.354 + XTB = -2.56 + EG = 1.103 + XTI = 0 + CJE = 2.187E-013 + VJE = 1 + MJE = 0.6662 + TF = 1.45381E-012 + XTF = 1 + VTF = 0.164654 + ITF = 0.940064 + PTF = 17.5 + CJC = 1.834E-013 + VJC = 0.4096 + MJC = 0.4691 + XCJC = 0.5 + TR = 1E-009 + CJS = 1.7E-013 + MJS = 0.1192 + VJS = 0.51 + FC = 0.2723 + KF = 2.77E-011 + AF = 1.92) *************************************************************** * .ENDS BFP650 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP720 <<< * (C) 2012 Infineon Technologies AG * Version 3.1 JULY 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 420 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * 0°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25°C, GMIN= 1.00e-12 *BFP720 C B E1 E2 .SUBCKT BFP720 1 2 3 4 * CBEPAR 22 33 1.673E-013 CBCPAR 22 11 4.302E-014 CCEPAR 11 33 1.457E-013 LB 22 20 7.12E-010 LE 33 30 7.9E-011 LC 11 10 7.12E-010 CBEPCK 20 30 6E-014 CBCPCK 20 10 1.222E-015 CCEPCK 10 30 6E-014 LBX 20 2 3.02E-010 LEX 30 34 2.217E-011 LCX 10 1 3.02E-010 * RPS 33 55 0.1365 RSub 55 30 800 * RE1 34 3 1E-03 RE2 34 4 1E-03 * Q1 11 22 33 55 M_BFP720 * Diode_sub 55 11 M_Diode_sub * .MODEL M_Diode_sub D( + IS = 4.085E-015 + N = 1.02 + RS = 800 + CJO = 4E-014) * .MODEL M_BFP720 NPN( + TNOM = 25 + IS = 7.621E-016 + BF = 646.8 + NF = 1.017 + VAF = 120.2 + IKF = 0.08618 + ISE = 1.782E-014 + NE = 2 + BR = 90.95 + NR = 1.012 + VAR = 1.455 + IKR = 0.008585 + ISC = 2.278E-014 + NC = 1.5 + RB = 7.151 + IRB = 0 + RBM = 1.031 + RE = 0.321 + RC = 5.9 + XTB = -2.407 + EG = 1.11 + XTI = 0.3 + CJE = 6.754E-014 + VJE = 1.064 + MJE = 0.1384 + TF = 2.611E-012 + XTF = 3.2 + VTF = 2.294 + ITF = 0.7341 + PTF = 0.1 + CJC = 4.36E-014 + VJC = 1.073 + MJC = 0.9219 + XCJC = 0.5 + TR = 2.035E-009 + CJS = 7.013E-014 + MJS = 0.09104 + VJS = 1.063 + FC = 0.5 + KF = 3.4E-012 + AF = 1.5) *************************************************************** * .ENDS BFP720 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP720ESD <<< * (C) 2010 Infineon Technologies AG * Version 1.0 Juni 2010 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 415 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP720ESD C B E1 E2 .SUBCKT BFP720ESD 1 2 31 32 * CBEPAR 22 33 1.048E-013 CBCPAR 22 11 2.58E-014 CCEPAR 11 33 2.737E-013 LB 22 20 6.327E-010 LE 33 30 1.864E-010 LC 11 10 5.957E-010 CBEPCK 20 30 9.242E-014 CBCPCK 20 10 1.779E-015 CCEPCK 10 30 8.276E-014 LBX 20 2 3.338E-010 LEX 30 3 9.323E-011 LCX 10 1 2.42E-010 * R_Tr 44 4 683.3 * D1 33 25 M_D1 D2 4 25 M_D2 * RBLfdb 22 25 1.828 RPS 33 4 0.1123 RSUB 30 4 0.05469 * D3 4 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * RLDNBL 15 11 6.471 * RE1 3 31 1E-03 RE2 3 32 1E-03 * Q1 11 22 33 44 M_BFP720ESD * * .MODEL M_D1 D( + IS=2.5E-017 + N=1.02 + RS=6.1 + CJO=1.968E-014) * * .MODEL M_D2 D( + IS=2E-018 + N=1.02 + RS=4170 + CJO=4.284E-015) * * .MODEL M_D3 D( + IS=3.5E-015 + N=1.02 + RS=1380 + CJO =9.378E-014) * * .MODEL M_D4 D( + IS=3.5E-015 + N=1.02 + RS=0.2 + CJO =3.128E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =5.321E-014) * * * * .MODEL M_BFP720ESD NPN( + TNOM = 25 + IS = 7.612E-016 + BF = 518.4 + NF = 1.026 + VAF = 157.5 + IKF = 0.05529 + ISE = 5.344E-015 + NE = 1.829 + BR = 264.6 + NR = 0.9669 + VAR = 2.278 + IKR = 0.002409 + ISC = 4.758E-015 + NC = 1.568 + RB = 8.442 + IRB = 0 + RBM = 0.1186 + RE = 0.05132 + RC = 2.182 + XTB = -2.1 + EG = 1.11 + XTI = 0.1 + CJE = 5.895E-014 + VJE = 1 + MJE = 0.9539 + TF = 2.521E-012 + XTF = 17.49 + VTF = 0.5295 + ITF = 0.5638 + PTF = 4.667 + CJC = 8.027E-014 + VJC = 0.4174 + MJC = 0.3969 + XCJC = 0.4894 + TR = 1.793E-009 + CJS = 5.433E-014 + MJS = 0.6481 + VJS = 0.6332 + FC = 0.7712 + KF = 1.264E-010 + AF = 1.672) *************************************************************** * * .ENDS BFP720ESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP720F <<< * (C) 2016 Infineon Technologies AG * Version 3.2 May 2016 *************************************************************** *.OPTION GMIN= 1.00e-12 *BFP720F 111 22 31 32 .SUBCKT BFP720F 111 22 31 32 * CBEPAR 2 3 2.472E-013 CBCPAR 2 10 2.305E-014 CCEPAR 10 3 1.782E-013 LEx 30 33 5.158E-015 LBx 20 22 4.607E-010 LCx 11 111 1.956E-012 CBEPCK 20 30 5.382E-014 CBCPCK 11 20 7.955E-015 CCEPCK 11 30 5.43E-014 LB 2 20 5.778E-012 LE 3 30 6.499E-011 LC 10 11 6.19E-010 * RE1 33 31 1E-03 RE2 33 32 1E-03 * RSub 4 30 260 Rcx 1 10 1 * Diode_sub 4 1 M_Diode_sub * .MODEL M_Diode_sub D( + IS = 2.8E-017 + N = 1.12056 + RS = 1380 + CJO = 4E-014 + TNOM = 25) * Q1 1 2 3 4 M_BFP720F * .MODEL M_BFP720F NPN( + TNOM = 25 + IS = 4.011E-016 + BF = 783.1 + NF = 0.9902 + VAF = 85.4 + IKF = 0.1076 + ISE = 3.207E-015 + NE = 1.72 + BR = 96.7489 + NR = 0.988174 + VAR = 1.299 + IKR = 0.00957834 + ISC = 2.75941E-016 + NC = 1.89506 + RB = 1.857 + IRB = 0.000703 + RBM = 0.9318 + RE = 0.2409 + RC = 20 + XTB = -2.482 + EG = 1.11 + XTI = 0.808 + CJE = 1.274E-014 + VJE = 0.9206 + MJE = 0.7053 + TF = 1.787E-012 + XTF = 4.073 + VTF = 0.3278 + ITF = 0.0008605 + PTF = 1.208E-012 + CJC = 2.029E-014 + VJC = 0.01 + MJC = 3.12E-005 + XCJC = 0.647 + TR = 6E-010 + CJS = 7.762E-014 + MJS = 0.07466 + VJS = 0.1179 + FC = 0.8156 + KF = 2.56E-011 + AF = 1.8) *************************************************************** * * .ENDS BFP720F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP720FESD <<< * (C) 2012 Infineon Technologies AG * Version 3.1 JULY 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 405 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP720FESD C B E1 E2 .SUBCKT BFP720FESD 1 2 3 4 * * CBEPAR 22 33 1.873E-013 CBCPAR 22 11 4.3E-014 CCEPAR 11 33 2.059E-013 LB 22 20 4.14E-010 LE 33 30 4.8E-011 LC 11 10 4.188E-010 CBEPCK 20 30 5E-014 CBCPCK 20 10 2E-015 CCEPCK 10 30 5E-014 LBX 20 2 177E-12 LEX 30 34 25.00E-12 LCX 10 1 177E-12 * RE1 34 3 1E-03 RE2 34 4 1E-03 * D1 33 25 M_D1 D2 55 25 M_D2 RBLfdb 22 25 3.2 RPS 33 55 0.4524 RSUB 30 55 800 D3 55 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 RLDNBL 15 11 14.8 * * Q1 11 22 33 55 M_BFP720FESD * * .MODEL M_D1 D( + IS=3.5E-015 + N=1.02 + RS=6.1 + CJO=4E-014 + TNOM= 25) * * .MODEL M_D2 D( + IS=3.5E-015 + N=1.02 + RS=4170 + CJO=4.5E-014 + TNOM= 25) * * .MODEL M_D3 D( + IS=7.835E-016 + N=1.053 + RS=1380 + CJO =9.5E-014 + TNOM= 25) * * .MODEL M_D4 D( + IS=3.5E-015 + N=1.02 + RS=0.2 + CJO =3E-014 + TNOM= 25) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014 + TNOM= 25) * * .MODEL M_BFP720FESD NPN( + TNOM= 25 + IS = 7.621E-016 + BF = 719.4 + NF = 1.017 + VAF = 120.2 + IKF = 0.08618 + ISE = 2.328E-014 + NE = 2 + BR = 307.1 + NR = 1.012 + VAR = 1.455 + IKR = 0.008585 + ISC = 2.278E-014 + NC = 1.5 + RB = 7.151 + IRB = 0 + RBM = 1.031 + RE = 0.321 + RC = 5.9 + XTB = -1.7 + EG = 1.11 + XTI = 0.1 + CJE = 6.754E-014 + VJE = 1.064 + MJE = 0.1384 + TF = 2.22714E-012 + XTF = 3.2 + VTF = 2.294 + ITF = 0.7341 + PTF = 0.1 + CJC = 4.36E-014 + VJC = 1.073 + MJC = 0.9219 + XCJC = 0.5 + TR = 2.035E-009 + CJS = 7.013E-014 + MJS = 0.09104 + VJS = 1.063 + FC = 0.5 + KF = 3.4E-012 + AF = 1.5) *************************************************************** * * .ENDS BFP720FESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP740 <<< * (C) 2013 Infineon Technologies AG * Version 3.1 April 2013 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 380 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP740 C B E1 E2 .SUBCKT BFP740 1 2 3 4 * * CBEPAR 22 33 1.67948E-013 CBCPAR 22 11 4.00262E-014 CCEPAR 11 33 2.38872E-013 LE 33 30 2.34376E-010 LB 22 20 7.31903E-010 LC 11 10 5.64051E-010 CBEPCK 20 30 4E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 4E-014 LBX 20 2 2.5E-010 LEX 30 35 7.95105E-011 LCX 10 1 2.5E-010 RSUB 30 5 0.01 RSUBNPN 55 5 648.513 Rpsinker 5 33 0.32 * RE1 35 3 1E-03 RE2 35 4 1E-03 * Q1 11 22 33 55 M_BFP740 * .MODEL M_BFP740 NPN( + TNOM = 25 + IS = 6.258E-016 + BF = 731.2 + NF = 0.9957 + VAF = 380.1 + IKF = 0.1155 + ISE = 3.922E-015 + NE = 1.728 + BR = 115 + NR = 0.9945 + VAR = 1.587 + IKR = 0.03122 + ISC = 3.205E-015 + NC = 2 + RB = 5.60166 + IRB = 0 + RBM = 1.12059 + RE = 0.622318 + RC = 4.121 + XTB = -2.154 + EG = 1.09 + XTI = 2.728 + CJE = 2.271E-013 + VJE = 0.6271 + MJE = 0.08129 + TF = 2.2263E-012 + XTF = 2.66 + VTF = 0.656428 + ITF = 0.244 + PTF = 0.1 + CJC = 4.78953E-014 + VJC = 1 + MJC = 0.00831201 + XCJC = 1 + TR = 1E-009 + CJS = 1.158E-013 + MJS = 0.2309 + VJS = 0.5201 + FC = 0.77 + KF = 8.93053E-017 + AF = 1.51228) *************************************************************** * * .ENDS BFP740 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP740ESD <<< * (C) 2011 Infineon Technologies AG * Version 2.1 June 2011 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 325 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note 'Thermal Resistance Calculation' AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP740ESD C B E1 E2 .SUBCKT BFP740ESD 1 2 3 4 * CBEPAR 22 33 3.7806E-013 CBCPAR 22 11 8E-014 CCEPAR 11 33 3.24147E-013 LB 22 20 7.18664E-010 LE 33 30 4.56769E-011 LC 11 10 5.64429E-010 CBEPCK 20 30 1.3E-013 CBCPCK 20 10 1E-015 CCEPCK 10 30 2.1553E-014 LBX 20 2 2.6238E-010 LEX 30 35 1.10378E-010 LCX 10 1 1.55253E-010 * R_Tr 55 5 307.5 * D1 33 25 M_D1 D2 5 25 M_D2 * RBLfdb 22 25 3.2 RPS 33 5 0.115215 RSUB 30 5 0.06119 * RE1 35 3 1E-03 RE2 35 4 1E-03 * D3 5 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * RLDNBL 15 11 14.8 * * Q1 11 22 33 55 M_BFP740ESD * * .MODEL M_D1 D( + IS=3.5E-015 + N=1 + RS=6.1 + CJO=1E-014) * * .MODEL M_D2 D( + IS=800E-018 + N=1 + RS=4170 + CJO=2.5E-014) * * .MODEL M_D3 D( + IS=800E-018 + N=1.02 + RS=1380 + CJO =3E-014) * * .MODEL M_D4 D( + IS=3.5E-015 + N=1 + RS=0.2 + CJO =3E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014) * * * * .MODEL M_BFP740ESD NPN( + TNOM = 25 + IS = 9.909E-016 + BF = 400.1 + NF = 1.03 + VAF = 175.2 + IKF = 0.04564 + ISE = 1.582E-013 + NE = 2.447 + BR = 263.9 + NR = 0.9644 + VAR = 10.96 + IKR = 0.002403 + ISC = 4.746E-015 + NC = 1.564 + RB = 6.30562 + IRB = 0.001 + RBM = 0.02485 + RE = 0.1001 + RC = 5.288 + XTB = -2.1 + EG = 1.1 + XTI = 0.1073 + CJE = 5.519E-014 + VJE = 0.7943 + MJE = 0.218 + TF = 2.15E-012 + XTF = 110.8 + VTF = 10 + ITF = 2.408 + PTF = 1.6 + CJC = 5.239E-014 + VJC = 0.6435 + MJC = 0.8443 + XCJC = 1 + TR = 3.25E-008 + CJS = 2.817E-013 + MJS = 0.3634 + VJS = 0.4952 + FC = 0.5 + KF = 7.32E-010 + AF = 1.948) *************************************************************** * * .ENDS BFP740ESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP740F <<< * (C) 2012 Infineon Technologies AG * Version 1.1 November 2012 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 300 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note -Thermal Resistance Calculation- AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP740F C B E1 E2 .SUBCKT BFP740F 1 2 3 4 * CBEPAR 22 33 1.528E-013 CBCPAR 22 11 6.274E-014 CCEPAR 11 33 1.958E-013 LE 33 30 1.588E-010 LB 22 20 3.61986E-010 LC 11 10 3.38494E-010 CBEPCK 20 30 3.5E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 3.5E-014 LBX 20 2 1.78E-010 LEX 30 35 5.40267E-011 LCX 10 1 1.78E-010 RSUB 30 5 0.0182719 RSUBNPN 55 5 213.779 Rpsinker 5 33 0.276699 * RE1 35 3 1E-03 RE2 35 4 1E-03 * Q1 11 22 33 55 M_BFP740F * .MODEL M_BFP740F NPN( + TNOM = 25 + IS = 1.249E-015 + BF = 987.1 + NF = 1.002 + VAF = 380.1 + IKF = 0.1898 + ISE = 3.488E-015 + NE = 1.709 + BR = 115 + NR = 1.01 + VAR = 1.229 + IKR = 0.02753 + ISC = 3.205E-015 + NC = 2 + RB = 7.015 + IRB = 6.026E-005 + RBM = 1.974 + RE = 0.18 + RC = 4.121 + XTB = -2.7 + EG = 1.09 + XTI = 0.1 + CJE = 2.531E-013 + VJE = 0.9286 + MJE = 0.06125 + TF = 2.331E-012 + XTF = 1.159 + VTF = 0.5242 + ITF = 0.3991 + PTF = 0.1 + CJC = 5.452E-014 + VJC = 0.4808 + MJC = 0.5812 + XCJC = 1 + TR = 1.532E-009 + CJS = 1.585E-013 + MJS = 0.2454 + VJS = 1 + FC = 0.2329 + KF = 1.616E-021 + AF = 1.677) *************************************************************** * .ENDS BFP740F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP740FESD <<< * (C) 2011 Infineon Technologies AG * Version 2.1 November 2011 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 315 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP740FESD C B E1 E2 .SUBCKT BFP740FESD 1 2 3 4 * * CBEPAR 22 33 2.238E-013 CBCPAR 22 11 3.747E-014 CCEPAR 11 33 1.739E-014 LB 22 20 6.808E-010 LE 33 30 5.756E-011 LC 11 10 3.687E-010 CBEPCK 20 30 2.474E-014 CBCPCK 20 10 1.304E-015 CCEPCK 10 30 1.148E-014 LBX 20 2 5.452E-015 LEX 30 35 4.806E-011 LCX 10 1 3.738E-011 * * * D1 33 25 M_D1 D2 55 25 M_D2 RBLfdb 22 25 3.2 RPS 33 55 0.5524 RSUB 30 55 0.3417 RE1 35 3 1E-03 RE2 35 4 1E-03 * D3 55 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 RLDNBL 15 11 14.8 * * Q1 11 22 33 55 M_BFP740FESD * * .MODEL M_D1 D( + IS=3.5E-015 + N=1.02 + RS=6.1 + CJO=4E-014) * .MODEL M_D2 D( + IS=800E-018 + N=1 + RS=4170 + CJO=2.5E-014) * * .MODEL M_D3 D( + IS=800E-018 + N=1.02 + RS=1380 + CJO =3E-014) * * .MODEL M_D4 D( + IS=3.5E-015 + N=1.02 + RS=0.2 + CJO =3E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014) * * * * .MODEL M_BFP740FESD NPN( + TNOM = 25 + IS = 1.136E-015 + BF = 738.2 + NF = 1.014 + VAF = 355.5 + IKF = 0.1325 + ISE = 5.97E-015 + NE = 1.737 + BR = 89.78 + NR = 0.98 + VAR = 1.396 + IKR = 0.1924 + ISC = 3.85E-015 + NC = 1.5 + RB = 3.631 + IRB = 0 + RBM = 2.02 + RE = 0.05983 + RC = 6.855 + XTB = -2.154 + EG = 1.11 + XTI = 2.728 + CJE = 1.08E-013 + VJE = 0.5522 + MJE = 0.2709 + TF = 1.596E-012 + XTF = 7.3788 + VTF = 2.70313 + ITF = 0.712422 + PTF = 0.2896 + CJC = 7.551E-014 + VJC = 0.9845 + MJC = 0.4393 + XCJC = 0.6466 + TR = 2.3E-007 + CJS = 6.09E-013 + MJS = 0.1942 + VJS = 0.7431 + FC = 0.8156 + KF = 732E-12 + AF = 1.948) *************************************************************** * * .ENDS BFP740FESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP750 <<< * (C) 2010 Infineon Technologies AG * Version 2.1 September 2010 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 360 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note 'Thermal Resistance Calculation' AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP750 C B E1 E2 .SUBCKT BFP750 1 2 3 4 * * CBEPAR 22 33 2.718E-013 CBCPAR 22 11 1.398E-013 CCEPAR 11 33 2.07221E-015 LB 22 20 9.917E-010 LC 11 10 7.02587E-011 CBEPCK 20 30 1.819E-014 CBCPCK 20 10 3.736E-018 CCEPCK 10 30 3.99247E-013 LBX 20 2 6.738E-015 LEX 30 35 9.035E-011 LCX 10 1 8.402E-010 RSUB 30 5 0.19 RSUBNPN 55 5 578 Rpsinker 5 33 0.16 RE1 35 3 1E-03 RE2 35 4 1E-03 * Q1 11 22 33 55 M_BFP750 * * * .MODEL M_BFP750 NPN( + TNOM = 25 + IS = 3.079E-015 + BF = 624.106 + NF = 1.011 + VAF = 150.2 + IKF = 0.245321 + ISE = 1.31E-014 + NE = 1.666 + BR = 138.7 + NR = 0.98 + VAR = 1.727 + IKR = 0.1924 + ISC = 3.85E-015 + NC = 1.5 + RB = 2.891 + IRB = 0.000889 + RBM = 1.504 + RE = 0.2121 + RC = 4.472 + XTB = -2.066 + EG = 1.034 + XTI = 0.808 + CJE = 6.905E-013 + VJE = 1.274 + MJE = 0.3898 + TF = 1.9094E-012 + XTF = 5.245 + VTF = 1.3 + ITF = 1.6 + PTF = 0.5287 + CJC = 2.491E-013 + VJC = 0.5152 + MJC = 0.4138 + XCJC = 0.6466 + TR = 5.76636E-008 + CJS = 4.70074E-013 + MJS = 0.4784 + VJS = 0.4645 + FC = 0.8156 + KF = 2.0E-011 + AF = 1.6) *************************************************************** * * .ENDS BFP750 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP760 <<< * (C) 2012 Infineon Technologies AG * Version 1.1 November 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 230 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** .OPTION TNOM=25, GMIN= 1.00e-12 *BFP760 C B E1 E2 .SUBCKT BFP760 1 2 3 4 * * CBEPAR 22 33 1.054E-013 CBCPAR 22 11 3.5E-014 CCEPAR 11 33 2.4E-013 LE 33 30 1.093E-010 LB 22 20 5.084E-010 LC 11 10 5.3E-010 CBEPCK 20 30 4E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 4E-014 LBX 20 2 2.4E-010 LEX 30 35 7.649E-011 LCX 10 1 2.4E-010 RSUB 30 5 0.19 RSUBNPN 55 5 213.3 Rpsinker 5 33 0.16 * RE1 35 3 1E-03 RE2 35 4 1E-03 * Q1 11 22 33 55 M_BFP760 * .MODEL M_BFP760 NPN( + TNOM = 25 + IS = 1.431E-015 + BF = 643.3 + NF = 1 + VAF = 482.4 + IKF = 0.1283 + ISE = 6.142E-015 + NE = 1.671 + BR = 132.5 + NR = 1 + VAR = 1.898 + IKR = 0.04884 + ISC = 3.034E-015 + NC = 2 + RB = 5 + IRB = 0 + RBM = 1.33 + RE = 0.1844 + RC = 4.861 + XTB = -2.428 + EG = 1.104 + XTI = 0 + CJE = 5.559E-013 + VJE = 1 + MJE = 0.04358 + TF = 1.951E-012 + XTF = 35.21 + VTF = 1.518 + ITF = 4 + PTF = 0.1 + CJC = 1.618E-013 + VJC = 0.4 + MJC = 0.2341 + XCJC = 0.7 + TR = 1.6E-009 + CJS = 2.721E-013 + MJS = 0.2237 + VJS = 0.5 + FC = 0.3851 + KF = 6.44E-017 + AF = 1.6) *************************************************************** * * .ENDS BFP760 *************************************************************** * Comments for the user: * The VBIC Model includes the self heating effect and the user can switch selfheating on or off. * a) no self heating: set Rth = 0 * b) with self heating: set Rth=80K/W + Rth_PCB (customer) * Note: Rth = 80 K/W includes only the thermal resistance of die and package and * the thermal resistance of the customer PCB must be added (Rth=80K/W + Rth_PCB) * Infineon Technologies AG * VBIC MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP780 <<< * (C) 2015 Infineon Technologies AG * Version 1.1 October 2015 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP780 C B E1 E2 .SUBCKT BFP780 1 2 3 4 * CCEPAR 11 33 800E-015 * LEx 30 35 3E-011 LBx 20 2 3E-011 LCx 10 1 3E-011 * CBPAD 22 44 30E-015 CCPAD 11 44 30E-015 CEPAD 33 44 30E-015 * LB 22 20 777E-12 LC 10 11 777E-12 * CBEPCK 20 30 5.703E-015 CBCPCK 10 20 1.497E-014 CCEPCK 10 30 6.032E-014 * RE1 35 3 1E-03 RE2 35 4 1E-03 * Rsub1 44 30 0.2144 Rps 44 33 0.07306 * D1 33 22 Diode_fb D2 44 22 Diode_fbd * .MODEL Diode_fb D( + IS=3.5E-015 + N=1 + CJO=10e-15 + RS=6.1 + Tnom=25) * .MODEL Diode_fbd D( + IS=1E-015 + N=1 + CJO=10E-15 + RS=1 + Tnom=25) * Q1 11 22 33 44 M_BFP780 * .MODEL M_BFP780 NPN Level=4( + Tnom=25 + Cbeo=2.47E-012 + Cje=561.3E-015 + Pe=0.7 + Me=0.333 + Aje=-1 + Wbe=1 + Cbco=10E-015 + Cjc=668.6E-015 + Pc=0.54 + Mc=0.333 + Ajc=-1 + Cjep=2.616E-015 + Cjcp=900E-015 + Ps=0.6 + Ms=0.3 + Ajs=-0.5 + Fc=0.94 + Vef=545.4 + Ver=3.291 + Is=2.3E-015 + Nf=0.9855 + Ibei=1.893E-018 + Nei=0.9399 + Iben=4.77E-015 + Nen=1.361 + Ikf=1 + Nr=0.9912 + Ibci=157.5E-018 + Nci=1.1 + Ibcn=4.929E-015 + Ncn=1.463 + Ikr=0.01178 + Wsp=1 + Isp=1E-015 + Nfp=1 + Ibcip=1E-015 + Ncip=1.029 + Ibcnp=1E-015 + Ncnp=1 + Ikp=1E-3 + Ibeip=1E-015 + Ibenp=1E-015 + Re=0.15 + Rcx=0.01 + Rci=2.665 + Qco=1E-015 + Vo=0.0005022 + Gamm=5.659E-012 + Hrcf=0.21 + Rbx=5 + Rbi=1.964 + Rbp=265.5 + Rs=26.56 + Avc1=3.97 + Avc2=29.52 + Tf=1.6E-012 + Qtf=50E-3 + Xtf=30 + Vtf=0.7 + Itf=1 + Tr=1E-015 + Td=500E-015 + Cth=0 + Rth=80 + Ea=1.12 + Eaie=1.12 + Eaic=1.12 + Eais=1 + Eane=1.12 + Eanc=1.12 + Eans=1 + Xre=0 + Xrb=0 + Xrc=0 + Xrs=0 + Xvo=0 + Xis=-1.631 + Xii=0 + Xin=0 + Tnf=0 + Tavc=0.002613 + Kfn=0 + Afn=1 + Bfn=1 ) *************************************************************** * .ENDS BFP780 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP840ESD <<< * (C) 2012 Infineon Technologies AG * Version 2.1 MAR 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the junction * temperature of the device in your application to get correct simulation results. * This procedure is necessary because the GP model does not consider the * self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 551 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP840ESD C B E1 E2 .SUBCKT BFP840ESD 1 2 3 4 * RE1 35 3 1E-03 RE2 35 4 1E-03 CBEPAR 22 33 1.112E-013 CBCPAR 22 11 2.935E-014 CCEPAR 11 33 2.803E-013 LB 22 20 7.403E-010 LE 33 30 2.5E-010 LC 11 10 6.756E-010 CBEPCK 20 30 4E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 4E-014 LBX 20 2 2E-010 LEX 30 35 8.453E-011 LCX 10 1 2E-010 * R_CS_npn 55 5 500 * D1 33 25 M_D1 D2 5 25 M_D2 * R_NBL_fdb 22 25 3.2 R_PS 33 5 0.03 RSUB 30 5 0.02 * D3 5 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * R_NBL_e11g 15 11 1.8 * Q1 11 22 33 55 M_BFP840ESD * .MODEL M_D1 D( + IS=3E-015 + N=1 + RS=2.846 + CJO=4E-014) * .MODEL M_D2 D( + IS=3E-015 + N=1 + RS=4170 + CJO=4.5E-014) * .MODEL M_D3 D( + IS=6.911E-016 + N=1.1 + RS=1380 + CJO =9.5E-014) * .MODEL M_D4 D( + IS=3.5E-015 + N=1 + RS=0.2 + CJO =3E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014) * .MODEL M_BFP840ESD NPN( + TNOM = 25 + IS = 2.067E-016 + BF = 964.2 + NF = 1 + VAF = 375.1 + IKF = 0.1222 + ISE = 3.144E-015 + NE = 1.82 + BR = 133.1 + NR = 0.9915 + VAR = 1.269 + IKR = 0.05566 + ISC = 1.165E-015 + NC = 2 + RB = 16.33 + IRB = 0 + RBM = 2.967 + RE = 0.18 + RC = 7.246 + XTB = -2.276 + EG = 1.11 + XTI = 0 + CJE = 5.171E-014 + VJE = 0.3736 + MJE = 0.5112 + TF = 1.21432E-012 + XTF = 27.91 + VTF = 0.344 + ITF = 2.119 + PTF = 0.0214 + CJC = 2E-014 + VJC = 0.8537 + MJC = 0.6257 + XCJC = 0.4894 + TR = 1E-010 + CJS = 1.369E-013 + MJS = 0.5946 + VJS = 1.072 + FC = 0.4403 + KF = 6.38495E-012 + AF = 1.43915) *************************************************************** * .ENDS BFP840ESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP840FESD <<< * (C) 2012 Infineon Technologies AG * Version 2.2 April 2016 * * Harald Boehm *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 541 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note -Thermal Resistance Calculation- AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. *************************************************************** * BFP840FESD C B E1 E2 only as a comment * .OPTION TNOM=25, GMIN= 1.00e-12 / leads to error message during circuit simulation * Parameter GMIN not known *.OPTION TNOM=25 .SUBCKT BFP840FESD 1 2 3 4 * RE1 35 3 1E-03 RE2 35 4 1E-03 * CBEPAR 22 33 1.5E-013 CBCPAR 22 11 3E-014 CCEPAR 11 33 1.5E-013 LB 222 20 4.3E-010 LE 333 30 1.5E-010 LC 111 10 4.3E-010 RBs 222 22 1.728 REs 333 33 2.5 RCs 111 11 5 K_BC LB LC 0.001 K_EB LE LB 0.1 K_EC LE LC 0.2 * CBEPCK 20 30 1.2E-014 CBCPCK 20 10 1.134E-014 CCEPCK 10 30 1.2E-014 LBX 20 2 5E-011 LEX 30 35 4.851E-011 LCX 10 1 2.329E-010 * R_CS_npn 44 5 0.1 * D1 33 25 M_D1 D2 5 25 M_D2 * R_NBL_fbd 22 25 1 RPS 33 5 0.09 RSUB 30 5 0.001 * D3 5 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * R_NBL_e11g 15 11 1 * .MODEL M_D1 D( + IS=3E-015 + N=0.9999 + RS=2.846 + M=0.5499 + CJO=1E-014 + VJ=0.7 + TNOM=25) * .MODEL M_D2 D( + IS= 3E-015 + N= 0.9999 + RS= 1208 + CJO=5E-015 + M= 0.5499 + TNOM=25 + VJ= 0.7) * .MODEL M_D3 D( + IS=1E-015 + N=1.1 + RS=4969 + CJO =1E-014 + M =0.4997 + TNOM=25 + VJ=0.7001) * .MODEL M_D4 D( + IS=3.5E-015 + N=0.9999 + RS=0.2 + CJO =1E-014 + M =0.4999 + TNOM=25 + VJ=0.7) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =1.2E-014 + M =0.4999 + TNOM=25 + VJ=0.7) * * Q1 11 22 33 44 M_BFP840FESD .MODEL M_BFP840FESD NPN( + TNOM = 25 + IS = 2.009E-016 + BF = 946.1 + NF = 1 + VAF = 300 + IKF = 0.1993 + ISE = 6.26E-015 + NE = 2 + BR = 108 + NR = 1 + VAR = 1.288 + IKR = 0.0007328 + ISC = 8.126E-016 + NC = 2 + RB = 17 + IRB = 0 + RBM = 1 + RE = 0.05 + RC = 4.145 + XTB = -2.276 + EG = 1.11 + XTI = 0 + CJE = 1.3E-013 + VJE = 0.6 + MJE = 0.5 + TF = 7.494E-013 + XTF = 17.49 + VTF = 0.5295 + ITF = 1.025 + PTF = 4.667 + CJC = 1.1E-014 + VJC = 0.67 + MJC = 0.88 + XCJC = 0.4894 + TR = 1.793E-009 + CJS = 3E-013 + MJS = 0.5 + VJS = 0.7 + FC = 0.352 + KF = 6.4E-012 + AF = 1.44) *************************************************************** * .ENDS BFP840FESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFP842ESD <<< * (C) 2012 Infineon Technologies AG * Version 1.1 June 2012 * * Harald Boehm *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 324 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note -Thermal Resistance Calculation- AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. *************************************************************** .SUBCKT BFP842ESD 1 2 3 4 *BFP842ESD C B E1 E2 only as a comment * RE1 35 3 1E-03 RE2 35 4 1E-03 * CBEPAR 22 33 2.863E-013 CBCPAR 22 11 6.361E-014 CCEPAR 11 33 5.95E-015 LB 222 20 1.069E-010 LE 333 30 2.904E-010 LC 111 10 2.688E-010 RBs 222 22 0.5 REs 333 33 0.3 RCs 111 11 0.5 * CE_PAD 33 50 6.447E-013 * CBEPCK 20 30 2.346E-013 CBCPCK 20 10 7.752E-016 CCEPCK 10 30 4.235E-013 LBX 20 2 8.377E-010 LEX 30 35 6.799E-011 LCX 10 1 8.371E-010 * R_CS_npn 44 150 500 * D1 50 25 M_D1 D2 150 25 M_D2 * R_NBL_fbd 22 25 1 RPS 50 150 0.76 RSUB 30 150 0.001 * D3 150 15 M_D3 D4 23 50 M_D4 D5 23 15 M_D5 * R_NBL_e11g 15 11 1 * .MODEL M_D1 D( + IS=3E-015 + N=0.9999 + RS=2.846 + M=0.5499 + CJO=1E-014 + VJ=0.7 * .MODEL M_D2 D( + IS= 3E-015 + N= 0.9999 + RS= 1208 + CJO=5E-015 + M= 0.5499 + VJ= 0.7) * .MODEL M_D3 D( + IS=1E-015 + N=1.1 + RS=4969 + CJO =1E-014 + M =0.4997 + VJ=0.7001) * .MODEL M_D4 D( + IS=3.5E-015 + N=0.9999 + RS=0.2 + CJO =1E-014 + M =0.4999 + VJ=0.7) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =1.2E-014 + M =0.4999 + VJ=0.7) * * Q1 11 22 33 44 M_BFP842ESD .MODEL M_BFP842ESD NPN( + TNOM = 25 + IS = 5.847E-016 + BF = 735 + NF = 1.017 + VAF = 200 + IKF = 0.1311 + ISE = 1.004E-013 + NE = 2.466 + BR = 119.7 + NR = 1.01 + VAR = 1.418 + IKR = 0.006107 + ISC = 1.203E-015 + NC = 1.764 + RB = 5.459 + IRB = 0 + RBM = 1.142 + RE = 0.3 + RC = 4.999 + XTB = -2.532 + EG = 1.1 + XTI = -1.865 + CJE = 1.67E-014 + VJE = 0.5111 + MJE = 0.5928 + TF = 1.3E-012 + XTF = 20 + VTF = 1.248 + ITF = 0.7412 + PTF = 0.1867 + CJC = 1.125E-014 + VJC = 0.6509 + MJC = 1.051 + XCJC = 0.4894 + TR = 1.099E-009 + CJS = 5.021E-013 + MJS = 0.2447 + VJS = 0.6438 + FC = 0.5 + KF = 6.4E-012 + AF = 1.44) *************************************************************** * .ENDS BFP842ESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP843 <<< * (C) 2013 Infineon Technologies AG * Version 1.1 MAR 2013 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 405 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP843 C B E1 E2 .SUBCKT BFP843 1 2 3 4 * RE1 35 3 1E-03 RE2 35 4 1E-03 CBEPAR 22 33 3.005E-013 CBCPAR 22 11 4.552E-014 CCEPAR 11 33 4.625E-013 * Cfeed 11 66 5.2E-012 Rfeed 66 22 1032 Cfeedpar 66 33 1.675E-013 * LB 22 20 7.965E-010 LE 33 30 2.56E-010 LC 11 10 6.465E-010 CBEPCK 20 30 4E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 4E-014 LBX 20 2 2.5E-010 LEX 30 35 9.953E-011 LCX 10 1 2.5E-010 * R_CS_npn 55 5 500 * D1 33 25 M_D1 D2 5 25 M_D2 * R_NBL_fdb 22 25 3.2 R_PS 33 5 0.2 RSUB 30 5 0.486 * D3 5 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * R_NBL_e11g 15 11 1.8 * Q1 11 22 33 55 M_BFP843 * .MODEL M_D1 D( + IS=3E-015 + N=1 + RS=2.846 + CJO=4E-014) * .MODEL M_D2 D( + IS=3E-015 + N=1 + RS=4700 + CJO=4.5E-014) * .MODEL M_D3 D( + IS=6.911E-016 + N=1.1 + RS=1380 + CJO =9.5E-014) * .MODEL M_D4 D( + IS=3.5E-015 + N=1 + RS=0.2 + CJO =3E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014) * .MODEL M_BFP843 NPN( + TNOM = 25 + IS = 2.226E-016 + BF = 850.3 + NF = 0.997 + VAF = 375.1 + IKF = 0.1713 + ISE = 4.539E-015 + NE = 1.958 + BR = 98.98 + NR = 0.9941 + VAR = 1.375 + IKR = 0.05974 + ISC = 1.578E-015 + NC = 1.8 + RB = 6.217 + IRB = 0 + RBM = 1.774 + RE = 0.329 + RC = 7.24 + XTB = -2.276 + EG = 1.11 + XTI = 0 + CJE = 8.091E-014 + VJE = 0.9141 + MJE = 0.06778 + TF = 1.02369E-012 + XTF = 1 + VTF = 0.1832 + ITF = 0.5237 + PTF = 0.5 + CJC = 3.125E-014 + VJC = 0.6892 + MJC = 0.5349 + XCJC = 0.8 + TR = 1E-009 + CJS = 2.575E-013 + MJS = 0.5599 + VJS = 0.4343 + FC = 0.5715 + KF = 3.12E-016 + AF = 1.529) *************************************************************** * .ENDS BFP843 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFP843F <<< * (C) 2013 Infineon Technologies AG * Version 1.1 MAR 2013 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 395 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFP843F C B E1 E2 .SUBCKT BFP843F 1 2 3 4 * RE1 35 3 1E-03 RE2 35 4 1E-03 CBEPAR 22 33 2.709E-013 CBCPAR 22 11 4.093E-014 CCEPAR 11 33 3.393E-013 * Cfeed 11 66 5.2E-012 Rfeed 66 22 1000 Cfeedpar 66 33 2.662E-013 * LB 22 20 5.524E-010 LE 33 30 1.501E-010 LC 11 10 4.66E-010 CBEPCK 20 30 3E-014 CBCPCK 20 10 1E-015 CCEPCK 10 30 3E-014 LBX 20 2 1.343E-010 LEX 30 35 7.069E-011 LCX 10 1 1.444E-010 * K_BC LB LC 0.001 K_EB LE LB 0.1508 K_EC LE LC 0.1017 * R_CS_npn 55 5 500 * D1 33 25 M_D1 D2 5 25 M_D2 * R_NBL_fdb 22 25 3.2 R_PS 33 5 0.2 RSUB 30 5 0.3859 * D3 5 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * R_NBL_e11g 15 11 1.8 * Q1 11 22 33 55 M_BFP843F * .MODEL M_D1 D( + IS=3E-015 + N=1 + RS=2.846 + CJO=4E-014) * .MODEL M_D2 D( + IS=3E-015 + N=1 + RS=4700 + CJO=4.5E-014) * .MODEL M_D3 D( + IS=6.911E-016 + N=1.1 + RS=1380 + CJO =9.5E-014) * .MODEL M_D4 D( + IS=3.5E-015 + N=1 + RS=0.2 + CJO =3E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014) * .MODEL M_BFP843F NPN( + TNOM = 25 + IS = 2.226E-016 + BF = 850.3 + NF = 0.997 + VAF = 375.1 + IKF = 0.1713 + ISE = 5.015E-015 + NE = 1.958 + BR = 98.98 + NR = 0.9941 + VAR = 1.375 + IKR = 0.05974 + ISC = 1.578E-015 + NC = 1.8 + RB = 6.217 + IRB = 0 + RBM = 1.774 + RE = 0.3424 + RC = 7.24 + XTB = -2.276 + EG = 1.11 + XTI = 0 + CJE = 8.091E-014 + VJE = 0.9141 + MJE = 0.06778 + TF = 8.467E-013 + XTF = 1 + VTF = 0.1832 + ITF = 0.5237 + PTF = 0.5 + CJC = 3.125E-014 + VJC = 0.6892 + MJC = 0.5349 + XCJC = 0.8 + TR = 1E-009 + CJS = 2.575E-013 + MJS = 0.5599 + VJS = 0.4343 + FC = 0.5715 + KF = 2.476E-016 + AF = 1.517) *************************************************************** * .ENDS BFP843F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFQ19S <<< * (C) 2014 Infineon Technologies AG * Version 2.1 October 2014 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFQ19S C B E .SUBCKT BFQ19S 11 22 33 * CBEPAR 2 3 1.941E-014 CBCPAR 2 1 5.476E-013 CCEPAR 1 3 7.843E-013 LB 2 20 2.448E-009 LE 3 30 1.706E-009 Rci 1 10 0.002258 CBEPCK 20 30 8.568E-016 CBCPCK 10 20 1.201E-014 CCEPCK 10 30 8.448E-014 LBX 20 22 7.525E-013 LEX 30 33 1.178E-010 LCX 10 11 2.449E-010 * * Q1 1 2 3 M_BFQ19S * * .MODEL M_BFQ19S NPN( + TNOM = 25 + IS = 1.734E-015 + BF = 126.2 + NF = 0.9968 + VAF = 52.15 + IKF = 1.035 + ISE = 7.715E-015 + NE = 1.81 + BR = 13.1 + NR = 0.9968 + VAR = 3.079 + IKR = 0.1214 + ISC = 6.257E-015 + NC = 1.6 + RB = 5.552 + IRB = 2.4E-005 + RBM = 1.524 + RE = 0.2261 + RC = 1.814 + XTB = 0.854 + EG = 1.11 + XTI = 9.516 + CJE = 4.551E-012 + VJE = 0.7397 + MJE = 0.3271 + TF = 2.467E-011 + XTF = 4.69 + VTF = 6.79 + ITF = 1.027 + PTF = 9.546E-017 + CJC = 1.164E-012 + VJC = 0.6791 + MJC = 0.3983 + XCJC = 0.007944 + TR = 3.412E-008 + CJS = 0 + VJS = 0.3601 + MJS = 0.02997 + FC = 0.567 + KF = 2.2E-14 + AF = 1.6) *************************************************************** * * .ENDS BFQ19S *************************************************************** * Comments for the user: * The VBIC Model includes the self heating effect and the user can switch selfheating on or off. * a) no self heating: set Rth = 0 * b) with self heating: set Rth=20K/W + Rth_PCB (customer) * Note: Rth = 20 K/W includes only the thermal resistance of die and package and * the thermal resistance of the customer PCB must be added (Rth=20K/W + Rth_PCB) * Infineon Technologies AG * VBIC MODEL * VALID UP TO 6 GHZ * >>> BFQ790 <<< * (C) 2015 Infineon Technologies AG * Version 1.0 Juni 2015 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFQ790 C B E * without access to the external thermal node (Rth to be adjusted by the customer in the model parameter list for the transistor .SUBCKT BFQ790 1 2 3 * * with access to external thermal node *.SUBCKT BFQ790 1 2 3 55 * CCSPAR 11 44 1.375E-012 LEx 30 3 4.36882E-011 LBx 20 2 2.77681E-011 LCx 10 1 4.265E-011 CBEPCK 20 30 1.105E-013 CBCPCK 10 20 1E-014 CCEPCK 10 30 1E-015 LB 222 20 1.02449E-009 LC 10 11 1.89901E-009 * RBL 222 22 45 CBL 222 22 3E-011 * Rsub1 44 30 0.000500184 Rps 44 33 0.102733 * * * without access to the external thermal node Q1 11 22 33 44 M_BFQ790 * * with access to the thermal node * Q1 11 22 33 44 55 M_BFQ790 * .MODEL M_BFQ790 NPN Level=4( + Tnom=25 + Cbeo=9.31E-012 + Cje=7.693E-013 + Pe=0.5892 + Me=0.3115 + Aje=-0.5 + Wbe=1 + Cbco=1.966E-013 + Cjc=1E-015 + Pc=0.5095 + Mc=0.2797 + Ajc=-0.5 + Cjep=1.875E-012 + Cjcp=2.067E-012 + Ps=0.5086 + Ms=0.2865 + Ajs=-0.5 + Fc=0.93 + Vef=615.1 + Ver=5.61838 + Is=9.704E-015 + Nf=1.001 + Ibei=5E-017 + Nei=1.013 + Iben=3.609E-014 + Nen=1.46 + Ikf=2 + Nr=0.9958 + Ibci=1.001E-017 + Nci=1.015 + Ibcn=2.918E-014 + Ncn=1.399 + Ikr=0.2301 + Wsp=1 + Isp=1E-015 + Nfp=1 + Ibcip=2E-017 + Ncip=1 + Ibcnp=1.7E-015 + Ncnp=1.67 + Ikp=0.0002 + Ibeip=7E-017 + Ibenp=2.4E-014 + Re=0.2 + Rcx=0.02559 + Rci=1.168 + Qco=4E-015 + Vo=0.4234 + Gamm=2.199E-012 + Hrcf=0.1907 + Rbx=0.2825 + Rbi=1.868 + Rbp=0.001 + Rs=10 + Avc1=1 + Avc2=25.84 + Tf=3E-012 + Qtf=0.6758 + Xtf=0.01293 + Vtf=0.5 + Itf=0.1948 + Tr=1E-015 + Td=1E-015 + Cth=0 + Rth=20.05 + Ea=1.12 + Eaie=1.12 + Eaic=1.12 + Eais=1.12 + Eane=1.12 + Eanc=1.12 + Eans=1.12 + Xre=0 + Xrb=0 + Xrc=0 + Xrs=0 + Xvo=0 + Xis=1.907 + Xii=4.963 + Xin=-2.837 + Tnf=1E-006 + Tavc=0.006705 + Kfn=0 + Afn=1 + Bfn=1 ) *************************************************************** * .ENDS BFQ790 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR106 <<< * (C) 2012 Infineon Technologies AG * Version 2.1 January 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 110 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR106 C B E .SUBCKT BFR106 1 2 3 * CBEPAR 22 33 2.22E-012 CBCPAR 22 11 4.288E-013 CCEPAR 11 33 2.621E-015 LB 22 20 6.736E-010 LE 33 30 6.937E-010 CBEPCK 20 30 1.567E-014 CBCPCK 11 20 1.975E-013 CCEPCK 11 30 1.497E-013 LBX 20 2 7.342E-010 LEX 30 3 6.492E-010 LCX 11 1 6.908E-010 * Q1 11 22 33 M_BFR106 * .MODEL M_BFR106 NPN( + TNOM = 25 + IS = 1.779E-015 + BF = 113.8 + NF = 1 + VAF = 27.87 + IKF = 1.181 + ISE = 1.644E-014 + NE = 2 + BR = 22 + NR = 0.9964 + VAR = 3.898 + IKR = 0.1065 + ISC = 8.839E-014 + NC = 1.567 + RB = 4.5 + IRB = 0 + RBM = 2.5 + RE = 0.07303 + RC = 5.1 + XTB = 1.303 + EG = 1.12 + XTI = 6.548 + CJE = 4.149E-012 + VJE = 0.8551 + MJE = 0.4611 + TF = 2.345E-011 + XTF = 10.29 + VTF = 7.452 + ITF = 0.5446 + PTF = 0.08058 + CJC = 9.627E-013 + VJC = 0.5893 + MJC = 0.4818 + XCJC = 0.5631 + TR = 1.434E-010 + CJS = 0 + VJS = 1 + MJS = 1 + FC = 0.5 + KF = 8.22E-015 + AF = 1.51) *************************************************************** * .ENDS BFR106 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR181W <<< * (C) 2013 Infineon Technologies AG * Version 2.1 September 2013 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR181W 11 22 33 .SUBCKT BFR181W 11 22 33 * CBEPAR 2 3 3.153E-013 CBCPAR 2 1 1.953E-013 CCEPAR 1 3 2.47E-013 LE 33 30 1.956E-010 LB 22 20 2.014E-010 LC 1 11 3.021E-010 CBEPCK 20 30 4.406E-014 CBCPCK 20 1 1E-015 CCEPCK 1 30 3.836E-014 LBI 20 2 5.35688E-010 LEI 30 3 6.16264E-010 * Q1 1 2 3 M_BFR181W * .MODEL M_BFR181W NPN( + TNOM = 25 + IS = 8.794E-017 + BF = 116.9 + NF = 1 + VAF = 68.1 + IKF = 0.08128 + ISE = 3.592E-016 + NE = 1.631 + BR = 16.5 + NR = 0.8776 + VAR = 6.876 + IKR = 0.2495 + ISC = 1.12E-017 + NC = 1.653 + RB = 8.87993 + IRB = 0 + RBM = 4.42095 + RE = 0.145 + RC = 0.7233 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 1.481E-013 + VJE = 0.7691 + MJE = 1.041 + TF = 1.45588E-011 + XTF = 107.12 + VTF = 0.291204 + ITF = 0.00428039 + PTF = 0 + CJC = 1.529E-013 + VJC = 0.7546 + MJC = 0.3099 + XCJC = 1 + TR = 1.75281E-008 + CJS = 0 + MJS = 0 + VJS = 0.901 + FC = 0.1651 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFR181W *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR182 <<< * (C) 2014 Infineon Technologies AG * Version 2.1 April 2014 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR182 1 2 3 .SUBCKT BFR182 11 22 33 * CBEPAR 2 3 2.851E-013 CBCPAR 2 1 3.214E-014 CCEPAR 1 3 1.816E-013 LE 33 30 6.492E-010 LB 22 20 7.342E-010 LC 11 1 6.908E-010 CBEPCK 20 30 1.567E-014 CBCPCK 20 1 1.975E-013 CCEPCK 1 30 1.497E-013 LBI 20 2 6.736E-010 LEI 30 3 6.937E-010 * Q1 1 2 3 M_BFR182 * .MODEL M_BFR182 NPN( + TNOM = 25 + IS = 2.252E-016 + BF = 105.3 + NF = 1.013 + VAF = 107.9 + IKF = 0.1003 + ISE = 9.034E-016 + NE = 1.719 + BR = 9 + NR = 1 + VAR = 16.96 + IKR = 0.075 + ISC = 8E-015 + NC = 2 + RB = 3.961 + IRB = 0 + RBM = 1.291 + RE = 0.1034 + RC = 0.4892 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 6.989E-013 + VJE = 1.295 + MJE = 0.6102 + TF = 1.614E-011 + XTF = 0.2049 + VTF = 4.868 + ITF = 0.4362 + PTF = 0.1029 + CJC = 2.364E-013 + VJC = 1.101 + MJC = 0.4605 + XCJC = 0.4261 + TR = 1.896E-008 + CJS = 0 + MJS = 1 + VJS = 1 + FC = 0.2197 + KF = 8.931E-017 + AF = 1.512) *************************************************************** * * .ENDS BFR182 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR182W <<< * (C) 2016 Infineon Technologies AG * Version 2.2 April 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR182W C B E1 E2 .SUBCKT BFR182W 11 22 33 * * CBEPAR 2 3 2.24E-013 CBCPAR 2 1 2.169E-013 CCEPAR 1 3 2E-013 LE 33 30 1E-010 LB 22 20 8E-011 LC 1 11 3.371E-010 CBEPCK 20 30 4E-014 CBCPCK 1 20 4E-014 CCEPCK 30 1 8E-014 LBI 20 2 8.794E-010 LEI 30 3 8.613E-010 * Q1 1 2 3 M_BFR182W * .MODEL M_BFR182W NPN( + TNOM = 25 + IS = 1.767E-016 + BF = 122.6 + NF = 1 + VAF = 75.55 + IKF = 0.457 + ISE = 6.25E-016 + NE = 1.653 + BR = 11.89 + NR = 0.9968 + VAR = 2.837 + IKR = 0.07193 + ISC = 9.862E-015 + NC = 2.026 + RB = 10.93 + IRB = 9.65E-005 + RBM = 0.8371 + RE = 0.2053 + RC = 4 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 6.488E-013 + VJE = 0.9 + MJE = 0.415 + TF = 1.346E-011 + XTF = 139.2 + VTF = 2.182 + ITF = 0.5642 + PTF = 0.1 + CJC = 2.167E-013 + VJC = 0.5482 + MJC = 0.3169 + XCJC = 0.788 + TR = 1.7E-008 + CJS = 0 + MJS = 1 + VJS = 1 + FC = 0.9999 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFR182W *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR193F <<< * (C) 2016 Infineon Technologies AG * Version 2.2 April 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR193F 11 22 33 .SUBCKT BFR193F 11 22 33 * CBEPAR 2 3 2.737E-013 CBCPAR 2 1 2.594E-013 CCEPAR 1 3 3.745E-014 LEI 3 30 2.79522E-010 LBI 2 20 2.78624E-010 CBEPCK 20 30 3.15E-014 CBCPCK 1 20 9.466E-014 CCEPCK 1 30 2.664E-015 LB 22 20 9.11766E-011 LE 30 33 1.72174E-010 LC 1 11 1.95916E-010 * Q1 1 2 3 M_BFR193F * .MODEL M_BFR193F NPN( + TNOM = 25 + IS = 4.981E-016 + BF = 114 + NF = 1 + VAF = 56.06 + IKF = 0.4814 + ISE = 3.125E-015 + NE = 1.723 + BR = 11.16 + NR = 0.9901 + VAR = 3.941 + IKR = 0.07071 + ISC = 2.254E-014 + NC = 1.894 + RB = 1.22358 + IRB = 0.0001166 + RBM = 0.85 + RE = 0.493289 + RC = 1.377 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 2.049E-012 + VJE = 0.8885 + MJE = 0.372 + TF = 1.552E-011 + XTF = 33.9 + VTF = 3.177 + ITF = 0.6292 + PTF = 1E-015 + CJC = 6.473E-013 + VJC = 0.5728 + MJC = 0.3598 + XCJC = 1 + TR = 5.53E-009 + CJS = 0 + MJS = 0 + VJS = 0.1 + FC = 0.9999 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFR193F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR193W <<< * (C) 2014 Infineon Technologies AG * Version 2.1 March 2014 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR193W 11 22 33 .SUBCKT BFR193W 11 22 33 * CBEPAR 2 3 5.631E-013 CBCPAR 2 1 1.951E-013 CCEPAR 1 3 2.672E-013 LE 33 30 1.321E-010 LB 22 20 1.799E-010 LC 1 11 4.115E-010 CBEPCK 20 30 7.019E-014 CBCPCK 1 20 1.127E-013 CCEPCK 30 1 1.608E-014 LBI 20 2 8.707E-010 LEI 30 3 7.404E-010 * Q1 1 2 3 M_BFR193W * .MODEL M_BFR193W NPN( + TNOM = 25 + IS = 4.786E-016 + BF = 120 + NF = 0.9942 + VAF = 50.17 + IKF = 0.5423 + ISE = 5.105E-015 + NE = 1.84 + BR = 8.857 + NR = 1.013 + VAR = 3.542 + IKR = 0.05596 + ISC = 3.304E-012 + NC = 13.24 + RB = 9.337 + IRB = 3.606E-005 + RBM = 0.8415 + RE = 0.1095 + RC = 1.707 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 2.131E-012 + VJE = 0.9537 + MJE = 0.4469 + TF = 7.90231E-012 + XTF = 500 + VTF = 4.13692 + ITF = 5.28251 + PTF = 0.0695 + CJC = 8.04E-013 + VJC = 0.6315 + MJC = 0.3621 + XCJC = 0.848 + TR = 1.568E-008 + CJS = 0 + MJS = 0.1549 + VJS = 0.4556 + FC = 0.8585 + KF = 0 + AF = 1) *************************************************************** * .ENDS BFR193W *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFR340F <<< * (C) 2012 Infineon Technologies AG * Version 2.1 January 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 530 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR340F C B E .SUBCKT BFR340F 1 2 3 * CBEPAR 22 33 3.138E-014 CBCPAR 22 11 5.04E-014 CCEPAR 11 33 1.229E-013 LB 22 20 5.086E-010 LE 33 30 4.152E-010 LBx 20 2 4.824E-011 LEx 30 3 5.149E-011 LCx 11 1 3.501E-010 CBEPCK 20 30 4.195E-015 CBCPCK 20 11 4.235E-014 CCEPCK 11 30 2.35E-014 * Q1 11 22 33 M_BFR340F * .MODEL M_BFR340F NPN( + TNOM = 25 + IS = 2.588E-017 + BF = 208.3 + NF = 1 + VAF = 80.12 + IKF = 0.1012 + ISE = 1.921E-015 + NE = 2 + BR = 8.99 + NR = 0.95 + VAR = 2.277 + IKR = 0.1924 + ISC = 3.85E-015 + NC = 1.5 + RB = 10.26 + IRB = 0 + RBM = 4.697 + RE = 1.016 + RC = 5.655 + XTB = -1.003 + EG = 1.11 + XTI = 2.728 + CJE = 9.724E-014 + VJE = 0.693 + MJE = 0.2059 + TF = 6.027E-012 + XTF = 12.98 + VTF = 1.928 + ITF = 0.04152 + PTF = 0.1 + CJC = 1.25E-013 + VJC = 0.5602 + MJC = 0.09189 + XCJC = 0.7499 + TR = 8.853E-005 + CJS = 0 + MJS = 1 + VJS = 1 + FC = 0.5 + KF = 3.4E-10 + AF = 2.1) *************************************************************** * * .ENDS BFR340F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR35AP <<< * (C) 2016 Infineon Technologies AG * Version 2.2 April 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR35AP C B E .SUBCKT BFR35AP 11 22 33 * CBEPAR 2 3 1.872E-013 CBCPAR 2 1 1.575E-013 CCEPAR 1 3 1.959E-013 LEI 3 30 1E-009 LBI 2 20 1E-009 CBEPCK 20 30 1.304E-014 CBCPCK 1 20 1.5E-013 CCEPCK 1 30 1.5E-013 LB 22 20 3E-010 LE 30 33 3E-010 LC 11 1 5.908E-010 * * Q1 1 2 3 M_BFR35AP * .MODEL M_BFR35AP NPN( + TNOM = 25 + IS = 2.241E-016 + BF = 127.2 + NF = 0.9935 + VAF = 55.34 + IKF = 0.1506 + ISE = 2.144E-015 + NE = 1.797 + BR = 10 + NR = 0.99 + VAR = 3.105 + IKR = 0.1135 + ISC = 4.7E-015 + NC = 2.001 + RB = 9.688 + IRB = 0.0001166 + RBM = 0.85 + RE = 0.9388 + RC = 4.925 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 6.901E-013 + VJE = 0.9 + MJE = 0.4469 + TF = 1.95E-011 + XTF = 453.7 + VTF = 5.969 + ITF = 1.249 + PTF = 1E-015 + CJC = 2.394E-013 + VJC = 0.5764 + MJC = 0.3352 + XCJC = 0.1048 + TR = 5.53E-009 + CJS = 0 + MJS = 0 + VJS = 0.1 + FC = 0.9999 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFR35AP *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFR380F <<< * (C) 2011 Infineon Technologies AG * Version 2.1 September 2011 *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+P*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 145 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note 'Thermal Resistance Calculation' AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR380F C B E .SUBCKT BFR380F 1 2 3 * CBEPAR 22 33 1.287E-014 CBCPAR 22 11 3.804E-013 CCEPAR 11 33 1.695E-013 LB 22 20 2.257E-010 LE 33 30 3.572E-010 CBEPCK 24 34 5.689E-015 CCEPCK 10 34 5.854E-014 CBCPCK 24 10 1.589E-015 LBX 24 2 1.469E-010 LEX 34 3 6.231E-011 LCX 10 1 2.247E-010 Rcx 11 10 0.882 Rbx 20 24 0.139 Rex 30 34 0.02676 * Q1 11 22 33 M_BFR380F * .MODEL M_BFR380F NPN( + TNOM = 25 + IS = 2.254E-016 + BF = 182.7 + NF = 0.9937 + VAF = 55.15 + IKF = 0.4285 + ISE = 1.222E-014 + NE = 2 + BR = 17.16 + NR = 0.9923 + VAR = 2.971 + IKR = 0.005662 + ISC = 6.038E-015 + NC = 1.5 + RB = 2.564 + IRB = 0 + RBM = 0.01719 + RE = 0.1976 + RC = 1.932 + XTB = 0.2643 + EG = 1.11 + XTI = 4.663 + CJE = 1.313E-012 + VJE = 1 + MJE = 0.34 + TF = 7.477E-012 + XTF = 17.27 + VTF = 1.329 + ITF = 0.61 + PTF = 4.667 + CJC = 2.876E-013 + VJC = 0.5861 + MJC = 0.4332 + XCJC = 1 + TR = 1.793E-009 + CJS = 0 + MJS = 1 + VJS = 1 + FC = 0.7064 + KF = 2.229E-013 + AF = 1.64) *************************************************************** * .ENDS BFR380F *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 10 GHZ * >>> BFR740L3RH <<< * (C) 2012 Infineon Technologies AG * Version 3.1 May 2012 * * Harald Boehm *************************************************************** * - Please use the global SPICE parameter TEMP to set the junction * temperature of this device in your circuit to get correct DC * simulation results. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated power * P=VCE*IC (IC collector current, VCE collector-emitter voltage). * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 320 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note -Thermal Resistance Calculation- AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature. * Please do not change this value. *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR740L3RH C B E .SUBCKT BFR740L3RH 1 2 3 * * CBEPAR 22 33 1.172E-014 CBCPAR 22 11 4.305E-014 CCEPAR 11 33 1.735E-013 * LB 222 20 4E-010 LC 111 10 4E-010 RBs 222 22 0.001 RCs 111 11 0.001 * CBEPCK 20 30 3E-014 CBCPCK 20 10 1.033E-014 CCEPCK 10 30 1E-013 LBX 20 2 1E-010 LEX 30 3 1E-011 LCX 10 1 5E-011 RSUB 30 4 0.19 RSUBNPN 44 4 578 Rpsinker 4 33 0.16 * Q1 11 22 33 44 M_BFR740L3RH * K LB LC 0.1 * * * .MODEL M_BFR740L3RH NPN( + TNOM = 25 + IS = 1.362E-015 + BF = 632 + NF = 1.027 + VAF = 120 + IKF = 0.09421 + ISE = 1.4E-013 + NE = 2.6 + BR = 100 + NR = 1 + VAR = 1.7 + IKR = 0.0035 + ISC = 5E-015 + NC = 2 + RB = 2 + IRB = 0.000889 + RBM = 0.6 + RE = 0.1019 + RC = 5.14 + XTB = -2.482 + EG = 1.034 + XTI = 0.808 + CJE = 3.14E-013 + VJE = 0.8119 + MJE = 0.1431 + TF = 1.667E-012 + XTF = 200 + VTF = 0.3493 + ITF = 0.3 + PTF = 1 + CJC = 8.419E-014 + VJC = 0.4412 + MJC = 0.3364 + XCJC = 0.6466 + TR = 2.786E-008 + CJS = 2.229E-013 + MJS = 0.2684 + VJS = 0.4393 + FC = 0.8156 + KF = 2.56E-011 + AF = 1.798) *************************************************************** * * .ENDS BFR740L3RH *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFR840L3RHESD <<< * (C) 2012 Infineon Technologies AG * Version 2.1 JUN 2012 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the junction * temperature of the device in your application to get correct simulation results. * This procedure is necessary because the GP model does not consider the * self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 521 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *BFR840L3RHESD C B E .SUBCKT BFR840L3RHESD 1 2 3 * Rcx 15 1 1.57895 Rbx 25 2 1.92983 Rex 35 3 0.0800447 * CBEPAR 22 33 1.9449E-013 CBCPAR 22 11 3.44161E-014 CCEPAR 11 33 2.24848E-013 LB 22 20 3.04259E-010 LC 11 10 2.88058E-010 CBEPCK 20 30 1E-014 CBCPCK 20 10 1.5502E-014 CCEPCK 10 30 1E-014 LBX 20 25 9.04631E-011 LEX 30 35 3.71422E-011 LCX 10 15 9.15043E-011 * R_CS_npn 55 5 500 * D1 33 25 M_D1 D2 5 25 M_D2 * R_NBL_fdb 22 25 3.2 R_PS 33 5 0.03 RSUB 30 5 0.03 * D3 5 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * R_NBL_e11g 15 11 1.8 * Q1 11 22 33 55 M_BFR840L3RHESD * .MODEL M_D1 D( + IS=3E-015 + N=1 + RS=2.846 + CJO=4E-014) * .MODEL M_D2 D( + IS=3E-015 + N=1 + RS=4170 + CJO=4.5E-014) * .MODEL M_D3 D( + IS=6.911E-016 + N=1.1 + RS=1380 + CJO =9.5E-014) * .MODEL M_D4 D( + IS=3.5E-015 + N=1 + RS=0.2 + CJO =3E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014) * .MODEL M_BFR840L3RHESD NPN( + TNOM = 25 + IS = 2.429E-016 + BF = 765.7 + NF = 1.012 + VAF = 375.1 + IKF = 0.0819 + ISE = 8.827E-014 + NE = 2.8 + BR = 194 + NR = 0.998 + VAR = 1.596 + IKR = 0.015 + ISC = 1.165E-015 + NC = 2 + RB = 7.53378 + IRB = 0 + RBM = 2.1 + RE = 0.4405 + RC = 7.246 + XTB = -2.276 + EG = 1.11 + XTI = -1.233 + CJE = 2.23E-014 + VJE = 0.9214 + MJE = 0.5 + TF = 1.1E-012 + XTF = 5.582 + VTF = 0.6828 + ITF = 0.4491 + PTF = 0.0214 + CJC = 6.6E-015 + VJC = 0.7723 + MJC = 1.005 + XCJC = 0.4894 + TR = 1E-010 + CJS = 1.147E-013 + MJS = 1.108 + VJS = 0.6112 + FC = 0.578 + KF = 1.65E-011 + AF = 1.53) *************************************************************** * .ENDS BFR840L3RHESD *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 12 GHZ * >>> BFR843EL3 <<< * (C) 2013 Infineon Technologies AG * Version 1.1 MAR 2013 *************************************************************** * - Please use the global SPICE GP parameter TEMP to specify the * junction temperature of the device in your application to get * correct simulation results. This procedure is necessary because * the GP model does not consider the self heating of the device. * - TEMP is calculated by TEMP=TA+Pdc*(RthJS+RthSA). The junction * temperature TEMP is the sum of the ambient temperature TA and * the increment of temperature caused by the dissipated DC power Pdc. * - RthJS is the thermal resistance between the junction and the * soldering point. RthJS for this device is 375 K/W. RthSA is the * thermal resistance of the PCB, from the soldering point to the * ambient. For determination of RthSA please refer to Infineon's * Application Note "Thermal Resistance Calculation" AN077. * - The model has been verified in the junction temperature range * -25°C to +125°C. * - TNOM=25 °C is the nominal ambient temperature during measurement * for the parameter extraction. Please do not change this value. **************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR843EL3 C B E .SUBCKT BFR843EL3 1 2 3 * * CBEPAR 22 33 2.608E-013 CBCPAR 22 11 4.054E-014 CCEPAR 11 33 3.59E-013 * Cfeed 11 66 5.2E-012 Rfeed 66 22 1000 Cfeedpar 66 33 1.672E-013 * LB 22 20 3.265E-010 LC 11 10 3.426E-010 CBEPCK 20 30 1E-014 CBCPCK 20 10 1.5E-014 CCEPCK 10 30 1E-014 LBX 20 2 6E-011 LEX 30 3 1.5E-011 LCX 10 1 6E-011 * K_BC LB LC 0.05034 * R_CS_npn 55 5 500 * D1 33 25 M_D1 D2 5 25 M_D2 * R_NBL_fdb 22 25 3.2 R_PS 33 5 0.2131 RSUB 30 5 0.0246 * D3 5 15 M_D3 D4 23 33 M_D4 D5 23 15 M_D5 * R_NBL_e11g 15 11 1.8 * Q1 11 22 33 55 M_BFR843EL3 * .MODEL M_D1 D( + IS=3E-015 + N=1 + RS=2.846 + CJO=4E-014) * .MODEL M_D2 D( + IS=3E-015 + N=1 + RS=4700 + CJO=4.5E-014) * .MODEL M_D3 D( + IS=6.911E-016 + N=1.1 + RS=1380 + CJO =9.5E-014) * .MODEL M_D4 D( + IS=3.5E-015 + N=1 + RS=0.2 + CJO =3E-014) * .MODEL M_D5 D( + IS=3.5E-015 + N=1.02 + RS=4.7 + CJO =3E-014) * .MODEL M_BFR843EL3 NPN( + TNOM = 25 + IS = 1.889E-016 + BF = 784.7 + NF = 1 + VAF = 375.1 + IKF = 0.1713 + ISE = 2.454E-015 + NE = 1.908 + BR = 98.98 + NR = 0.9941 + VAR = 1.375 + IKR = 0.05974 + ISC = 1.578E-015 + NC = 1.8 + RB = 5.716 + IRB = 0 + RBM = 1.477 + RE = 0.4167 + RC = 7.24 + XTB = -2.276 + EG = 1.11 + XTI = -1.233 + CJE = 8.091E-014 + VJE = 0.9141 + MJE = 0.06778 + TF = 1.007E-012 + XTF = 1 + VTF = 0.1832 + ITF = 0.5237 + PTF = 0.5 + CJC = 3.125E-014 + VJC = 0.6892 + MJC = 0.5349 + XCJC = 0.8 + TR = 1E-009 + CJS = 2.575E-013 + MJS = 0.5599 + VJS = 0.4343 + FC = 0.5715 + KF = 2.476E-016 + AF = 1.517) *************************************************************** * .ENDS BFR843EL3 *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR92P <<< * (C) 2016 Infineon Technologies AG * Version 2.2 April 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR92P C B E .SUBCKT BFR92P 11 22 33 * CBEPAR 2 3 1.872E-013 CBCPAR 2 1 1.575E-013 CCEPAR 1 3 1.959E-013 LEI 3 30 1E-009 LBI 2 20 1E-009 CBEPCK 20 30 1.304E-014 CBCPCK 1 20 1.5E-013 CCEPCK 1 30 1.5E-013 LB 22 20 3E-010 LE 30 33 3E-010 LC 11 1 5.908E-010 * * Q1 1 2 3 M_BFR92P * .MODEL M_BFR92P NPN( + TNOM = 25 + IS = 2.241E-016 + BF = 127.2 + NF = 0.9935 + VAF = 55.34 + IKF = 0.1506 + ISE = 2.144E-015 + NE = 1.797 + BR = 10 + NR = 0.99 + VAR = 3.105 + IKR = 0.1135 + ISC = 4.7E-015 + NC = 2.001 + RB = 9.688 + IRB = 0.0001166 + RBM = 0.85 + RE = 0.9388 + RC = 4.925 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 6.901E-013 + VJE = 0.9 + MJE = 0.4469 + TF = 1.95E-011 + XTF = 453.7 + VTF = 5.969 + ITF = 1.249 + PTF = 1E-015 + CJC = 2.394E-013 + VJC = 0.5764 + MJC = 0.3352 + XCJC = 0.1048 + TR = 5.53E-009 + CJS = 0 + MJS = 0 + VJS = 0.1 + FC = 0.9999 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFR92P *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR93A <<< * (C) 2016 Infineon Technologies AG * Version 2.2 April 2016 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR93A 11 22 33 .SUBCKT BFR93A 11 22 33 * CBEPAR 2 3 3.716E-013 CBCPAR 2 1 1.70719E-013 CCEPAR 1 3 2.083E-013 LEI 3 30 1E-009 LBI 2 20 1E-009 CBEPCK 20 30 1.304E-014 CBCPCK 1 20 1.5E-013 CCEPCK 1 30 1.5E-013 LB 22 20 3E-010 LE 30 33 3E-010 LC 1 11 6.2E-010 * Q1 1 2 3 M_BFR93A * .MODEL M_BFR93A NPN( + TNOM = 25 + IS = 6.872E-016 + BF = 134 + NF = 0.9872 + VAF = 30.8 + IKF = 0.3501 + ISE = 6.927E-016 + NE = 1.61 + BR = 22.18 + NR = 0.987 + VAR = 2.847 + IKR = 0.1135 + ISC = 1.465E-014 + NC = 2.001 + RB = 9.292 + IRB = 0.0001166 + RBM = 0.85 + RE = 0.34281 + RC = 1.266 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 2.029E-012 + VJE = 0.9052 + MJE = 0.4406 + TF = 2.248E-011 + XTF = 146.1 + VTF = 8 + ITF = 2.097 + PTF = 1E-015 + CJC = 5.99092E-013 + VJC = 0.554562 + MJC = 0.359703 + XCJC = 0.1048 + TR = 5.53E-009 + CJS = 0 + MJS = 0 + VJS = 0.75 + FC = 0.9999 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFR93A *************************************************************** * Infineon Technologies AG * GUMMEL-POON MODEL IN SPICE 2G6 SYNTAX * VALID UP TO 6 GHZ * >>> BFR93AW <<< * (C) 2014 Infineon Technologies AG * Version 2.1 March 2014 *************************************************************** *.OPTION TNOM=25, GMIN= 1.00e-12 *BFR93AW C B E .SUBCKT BFR93AW 11 22 33 * CBEPAR 2 3 3.297E-013 CBCPAR 2 1 2.991E-013 CCEPAR 1 3 2.712E-013 LEI 30 3 9E-010 LBI 20 2 9E-010 CBEPCK 20 30 1E-015 CBCPCK 20 1 6.06E-014 CCEPCK 1 30 3.088E-014 LB 22 20 1.002E-010 LE 33 30 8E-011 LC 11 1 2.618E-010 * Q1 1 2 3 M_BFR93AW * .MODEL M_BFR93AW NPN( + TNOM = 25 + IS = 7.812E-016 + BF = 114.4 + NF = 1 + VAF = 47.34 + IKF = 0.3039 + ISE = 5.518E-015 + NE = 1.87 + BR = 19.25 + NR = 0.9935 + VAR = 3.148 + IKR = 0.09474 + ISC = 2.383E-016 + NC = 1.169 + RB = 12.47 + IRB = 4.381E-005 + RBM = 0.85 + RE = 0.8144 + RC = 1.126 + XTB = 1.303 + EG = 1.11 + XTI = 6.548 + CJE = 2E-012 + VJE = 0.9 + MJE = 0.415 + TF = 2.13043E-011 + XTF = 40 + VTF = 3.40089 + ITF = 1.36553 + PTF = 0.016 + CJC = 5.951E-013 + VJC = 0.5713 + MJC = 0.3602 + XCJC = 1 + TR = 4.388E-009 + CJS = 0 + MJS = 0 + VJS = 0.8804 + FC = 0.9611 + KF = 0 + AF = 1) *************************************************************** * * .ENDS BFR93AW