* Filename:  PRF947_SPICE.PRM
* PRF947.PRM SPICE MODEL OF BJT TYPE PRF947
* PHILIPS SEMICONDUCTORS
* Date : April 1997
* PACKAGE : SOT323 DIE MODEL : XB510
* 1: PACKED COLLECTOR; 2: PACKED BASE; 3: PACKED EMITTER;
.SUBCKT PRF947 1 2 3
Q1 6 5 7 7 XB510
 
* SOT323 parasitic model including bondpads
               Lb   4 5 .6n
               Le   7 8 .6n
               L1   2 4 .34n
               L2   1 6 .1n
               L3   3 8 .34n
               Ccb  4 6 100f
               Cbe  4 8 2f
               Cce  6 8 100f
               Cbpb 5 6 83f
               Cbpe 7 6 84f
* PHILIPS SEMICONDUCTORS     Version:   1.0
* Filename:    XB510.PRM     Date: Feb 29 1996
* extracted batch 49917-4
.MODEL  XB510   NPN
+              IS = 4.66E-16
+              BF = 150.4
+              NF = 1
+             VAF = 53.06
+             IKF = 0.18
+             ISE = 5.73E-14
+              NE = 2
+              BR = 27.68
+              NR = 1
+             VAR = 1.976
+             IKR = 0.009943
+             ISC = 1.42E-18
+              NC = 1
+              RB = 12.14
+             IRB = 0
+             RBM = 4.957
+              RE = 0.5974
+              RC = 1.988
+             CJE = 5.681E-13
+             VJE = 0.6
+             MJE = 0.4122
+             CJC = 2.058E-13
+             VJC = 0.2962
+             MJC = 0.118
+             CJS = 0
+             VJS = 0.7
+             MJS = 0
+            XCJC = 0.1042
+              TR = 0
+              TF = 2.037E-12
+             XTF = 30.9
+             VTF = 3.148
+             ITF = 0.1318
+             PTF = 0
+              FC = 0.9431
+              EG = 1.11
+             XTI = 3
+              AF = 1
+              KF = 4.00E-16
* Parameters with default value:
* XTB, EG, XTI, CJS, VJE, VJS and MJS.
* BONDPAD CAP’S Cbpb=83E-15 Cbpe=84E-15 not included in model !
.END