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{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "(5.99.0-10431-gb63c482347)"
},
"CreationDate": "2021-08-10T09:59:27+02:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "boitarire",
"GUID": "626f6974-6172-4697-9265-2e6b69636164",
"Revision": "rev?"
},
"Size": {
"X": 55.0427,
"Y": 55.0063
},
"LayerNumber": 2,
"BoardThickness": 1.6,
"Finish": "None"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.0,
"PadToTrack": 0.0,
"TrackToTrack": 0.2,
"MinLineWidth": 0.25,
"TrackToRegion": 0.508,
"RegionToRegion": 0.508
}
],
"FilesAttributes": [
{
"Path": "boitarire-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "boitarire-B_Cu.gbr",
"FileFunction": "Copper,L2,Bot",
"FilePolarity": "Positive"
},
{
"Path": "boitarire-F_Silkscreen.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "boitarire-B_Silkscreen.gbr",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "boitarire-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "boitarire-B_Mask.gbr",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "boitarire-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Color": "Green",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Thickness": 1.51,
"Material": "FR4",
"Name": "F.Cu/B.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Color": "Green",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Name": "Bottom Silk Screen"
}
]
}