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(fp_text value 47uF (at 0.217766 -0.031) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603 (layer F.Cu) (tedit 5415CC62) (tstamp 57C37116)
(at 119.416 99.169 270)
(descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0603")
(path /57A213D7/57BD5AB7)
(attr smd)
(fp_text reference C2 (at 4.931 0.016 270) (layer F.SilkS)
(fp_text value 12pF (at 1.331 0.016 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0 270) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.75 0 270) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603 (layer F.Cu) (tedit 57CD3020) (tstamp 57C370F4)
(at 120.32122 94.564039)
(descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0603")
(path /57A213D7/57BCDE5F)
(attr smd)
(fp_text reference C10 (at 1.27878 -4.864039) (layer F.SilkS)
(fp_text value 12pF (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603 (layer F.Cu) (tedit 5415CC62) (tstamp 57C370D2)
(at 113.666 104.669)
(descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0603")
(path /57A213D7/57BD7E28)
(attr smd)
(fp_text reference C8 (at -0.036 1.561) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 100uF (at 0.534 0.031) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603 (layer F.Cu) (tedit 5415CC62) (tstamp 57C370B0)
(at 119.416 96.669 90)
(descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0603")
(path /57A213D7/57BD5AB1)
(attr smd)
(fp_text reference C4 (at -4.831 -0.016 90) (layer F.SilkS)
(fp_text value 12pF (at -0.231 -0.116 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0 90) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.75 0 90) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603 (layer F.Cu) (tedit 5415CC62) (tstamp 57C3708E)
(at 118.199899 92.089165 90)
(descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0603")
(path /57A213D7/57BCDE27)
(attr smd)
(fp_text reference C9 (at 4.289165 1.700101 90) (layer F.SilkS)
(fp_text value 12pF (at 0.089165 -0.099899 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0 90) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.75 0 90) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603 (layer F.Cu) (tedit 5415CC62) (tstamp 57C3706C)
(at 96.25 87.9 180)
(descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0603")
(path /57A213D7/57BD7DE5)
(attr smd)
(fp_text reference C7 (at 0.1 -1.49 180) (layer F.SilkS)
(fp_text value 100uF (at 0.05 0 180) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0 180) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 2 smd rect (at 0.75 0 180) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0805 (layer F.Cu) (tedit 5415CDEB) (tstamp 57C3704A)
(at 125.55 126.8)
(descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0805")
(path /57A213DC/57A232E9)
(attr smd)
(fp_text reference R29 (at 0 -1.75 180) (layer F.SilkS)
(fp_text value 120R (at 0.05 -0.1) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.6 -1) (end 1.6 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1) (end -1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1) (end 1.6 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.6 0.875) (end -0.6 0.875) (layer F.SilkS) (width 0.15))
(fp_line (start -0.6 -0.875) (end 0.6 -0.875) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
(model Resistors_SMD.3dshapes/R_0805.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_Array_Concave_4x0603 (layer F.Cu) (tedit 548A2EB7) (tstamp 57C36FFA)
(at 77.9 111.6 180)
(descr "Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)")
(tags "resistor array")
(path /57A213DB/57BDD171)
(attr smd)
(fp_text reference R9 (at 0 -2.5 180) (layer F.SilkS)
(fp_text value 49R9 (at 0.5 -0.4 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.55 -1.75) (end 1.55 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.55 1.75) (end 1.55 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.55 -1.75) (end -1.55 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.55 -1.75) (end 1.55 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.4 1.625) (end -0.4 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start 0.4 -1.625) (end -0.4 -1.625) (layer F.SilkS) (width 0.15))
(pad 2 smd rect (at -0.85 -0.4 180) (size 0.9 0.4) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -0.85 0.4 180) (size 0.9 0.4) (layers F.Cu F.Paste F.Mask)
(pad 1 smd rect (at -0.85 -1.2 180) (size 0.9 0.4) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -0.85 1.2 180) (size 0.9 0.4) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at 0.85 -1.2 180) (size 0.9 0.4) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at 0.85 -0.4 180) (size 0.9 0.4) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at 0.85 0.4 180) (size 0.9 0.4) (layers F.Cu F.Paste F.Mask)
(pad 5 smd rect (at 0.85 1.2 180) (size 0.9 0.4) (layers F.Cu F.Paste F.Mask)
(model Resistors_SMD.3dshapes/R_Array_Concave_4x0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module SMD_pin_header:SMD-pin-header_02x10_1.27mm (layer F.Cu) (tedit 56C2EFD2) (tstamp 57C36F74)
(at 124.09 108.22 180)
(descr "20-Pin SMD 1.27mm straight header")
(tags Pin_Header_Straight_2X10)
(path /57A213D7/57BD64F5)
(attr smd)
(fp_text reference P4 (at -1.67 -7.14 180) (layer F.SilkS)
(fp_text value "ARM 20PIN" (at -0.01 0.62 270) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.75 -6.35) (end 1.72 -6.35) (layer F.SilkS) (width 0.15))
(fp_line (start -1.72 6.35) (end 1.72 6.35) (layer F.SilkS) (width 0.15))
(fp_line (start -2.75 6.35) (end 2.75 6.35) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.75 -6.35) (end 2.75 -6.35) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.75 6.35) (end -2.75 -6.35) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.75 6.35) (end 2.75 -6.35) (layer F.CrtYd) (width 0.05))
(pad 1 smd rect (at -1.55 -5.71 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 2 smd rect (at 1.55 -5.71 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 2 /mcu/TMS))
(pad 3 smd rect (at -1.55 -4.45 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 4 smd rect (at 1.55 -4.45 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 4 /mcu/TCK))
(pad 5 smd rect (at -1.55 -3.17 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 6 smd rect (at 1.55 -3.17 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 5 /mcu/TDO))
(pad 7 smd rect (at -1.55 -1.9 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 4 /mcu/TCK))
(pad 8 smd rect (at 1.55 -1.9 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 6 /mcu/TDI))
(pad 9 smd rect (at -1.55 -0.63 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 10 smd rect (at 1.55 -0.63 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 7 /mcu/nRESET))
(pad 11 smd rect (at -1.55 0.63 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(pad 12 smd rect (at 1.55 0.63 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(pad 13 smd rect (at -1.55 1.91 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(pad 14 smd rect (at 1.55 1.91 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(pad 15 smd rect (at -1.55 3.18 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 16 smd rect (at 1.55 3.18 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(pad 17 smd rect (at -1.55 4.45 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 18 smd rect (at 1.55 4.45 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(pad 19 smd rect (at -1.55 5.71 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 20 smd rect (at 1.55 5.71 180) (size 2.4 0.76) (layers F.Cu F.Paste F.Mask)
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)
(module Hole:Plated-Hole_3mm (layer F.Cu) (tedit 57C61918) (tstamp 57C34CB7)
(at 53 133)
(path /57C359F2)
(fp_text reference H1 (at 0 2.1) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Hole (at 0 -4.2) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 3.5 0) (layer F.SilkS) (width 0.05))
(pad 1 thru_hole circle (at 0 -0.25) (size 4 4) (drill 3.2) (layers *.Cu)
(net 3 GND) (zone_connect 2))
)
(module Hole:Plated-Hole_3mm (layer F.Cu) (tedit 57099BB8) (tstamp 57C34CBD)
(at 139 133)
(path /57C359E5)
(fp_text reference H2 (at 0 2.1) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Hole (at 0 -4.2) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 3.5 0) (layer F.SilkS) (width 0.05))
(pad 1 thru_hole circle (at 0 0) (size 4 4) (drill 3.2) (layers *.Cu)
(net 3 GND) (zone_connect 2))
)
(module Hole:Plated-Hole_3mm (layer F.Cu) (tedit 57099BB8) (tstamp 57C34CC3)
(at 53 53)
(path /57C35944)
(fp_text reference H3 (at 0 2.1) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Hole (at 0 -4.2) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 3.5 0) (layer F.SilkS) (width 0.05))
(pad 1 thru_hole circle (at 0 0) (size 4 4) (drill 3.2) (layers *.Cu)
(net 3 GND) (zone_connect 2))
)
(module Housings_SOIC:SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 57C3D28C)
(at 107.339199 106.662316)
(descr "8-Lead Thermally Enhanced Plastic Small Outline (SE) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /57A213DC/57A26DD7)
(attr smd)
(fp_text reference U16 (at -4.439199 -0.022316 90) (layer F.SilkS)
(fp_text value MCP2562 (at 0.160801 0.537684) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
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(pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 9 smd rect (at 0.5875 0.5875) (size 1.175 1.175) (layers F.Cu F.Paste F.Mask)
(net 3 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at 0.5875 -0.5875) (size 1.175 1.175) (layers F.Cu F.Paste F.Mask)
(net 3 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.5875 0.5875) (size 1.175 1.175) (layers F.Cu F.Paste F.Mask)
(net 3 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.5875 -0.5875) (size 1.175 1.175) (layers F.Cu F.Paste F.Mask)
(net 3 GND) (solder_paste_margin_ratio -0.2))
(model Housings_SOIC.3dshapes/SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module ALPS_Tact:SKRP (layer F.Cu) (tedit 57247113) (tstamp 57C6336F)
(at 132.35 95.97 90)
(path /57A213D7/57BF8FC9)
(fp_text reference BTN1 (at 3.37 0.35 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Reset (at 0.27 -0.05 90) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.3 1.6) (end -2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 1.6) (end -2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.3 -1.6) (end 2.3 1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.3 -1.6) (end 2.3 -1.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 0 0.5) (end 0 1.075) (layer F.SilkS) (width 0.15))
(fp_line (start 0 -0.5) (end 0.5 0.5) (layer F.SilkS) (width 0.15))
(fp_line (start 0 -1.075) (end 0 -0.5) (layer F.SilkS) (width 0.15))
(fp_line (start -1.325 -1.075) (end 1.325 -1.075) (layer F.SilkS) (width 0.15))
(fp_line (start -1.325 1.075) (end 1.325 1.075) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.075 -1.075 90) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
(net 7 /mcu/nRESET))
(pad 2 smd rect (at 2.075 -1.075 90) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
(net 7 /mcu/nRESET))
(pad 3 smd rect (at -2.075 1.075 90) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 4 smd rect (at 2.075 1.075 90) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model /Users/nipo/projects/hardware/kicad-library/ALPS_Tact.3dshapes/SKRP.wrl
(at (xyz 0 0 0))
(scale (xyz 0.39 0.39 0.39))
(rotate (xyz -90 0 0))
)
)
(module Hole:Plated-Hole_3mm (layer F.Cu) (tedit 57099BB8) (tstamp 57C63454)
(at 139 53)
(path /57C61441)
(fp_text reference H4 (at 0 2.1) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Hole (at 0 -4.2) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 3.5 0) (layer F.SilkS) (width 0.05))
(pad 1 thru_hole circle (at 0 0) (size 4 4) (drill 3.2) (layers *.Cu)
(net 3 GND) (zone_connect 2))
)
(module Housings_SSOP:MSOP-8-1EP_3x3mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77) (tstamp 57C74D19)
(at 100.39 118.67)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
(path /57A213D7/57C74554)
(attr smd)
(fp_text reference U2 (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value AP2142A (at 0.81 -0.47) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.8 -1.8) (end -2.8 1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.8 -1.8) (end 2.8 1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 -1.8) (end 2.8 -1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 1.8) (end 2.8 1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.625 -1.625) (end -1.625 -1.41) (layer F.SilkS) (width 0.15))
(fp_line (start 1.625 -1.625) (end 1.625 -1.41) (layer F.SilkS) (width 0.15))
(fp_line (start 1.625 1.625) (end 1.625 1.41) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end -1.625 1.41) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.41) (end -2.55 -1.41) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 2 smd rect (at -2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 4 smd rect (at -2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 5 smd rect (at 2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at 2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at 2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at 2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
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(pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(net 3 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(net 3 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(net 3 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(net 3 GND) (solder_paste_margin_ratio -0.2))
(model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603 (layer F.Cu) (tedit 5415CC62) (tstamp 57C75006)
(at 110.9 111.21 270)
(descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0603")
(path /57A213DC/57C770F6)
(attr smd)
(fp_text reference C38 (at 0 -1.9 270) (layer F.SilkS)
(fp_text value 100nF (at 0.19 0.2 270) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0 270) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 2 smd rect (at 0.75 0 270) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Resistors_SMD:R_0603 (layer F.Cu) (tedit 5415CC62) (tstamp 57C7525E)
(at 101.78 109.31 180)
(descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
(tags "resistor 0603")
(path /57A213DC/57C779F7)
(attr smd)
(fp_text reference C39 (at -0.04 -1.52 360) (layer F.SilkS)
(fp_text value 100nF (at 0.88 0.01 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -0.8) (end -1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.3 -0.8) (end 1.3 0.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.5 0.675) (end -0.5 0.675) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -0.675) (end 0.5 -0.675) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0 180) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.75 0 180) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Resistors_SMD.3dshapes/R_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module TAG-Connect:TC2030-NL (layer F.Cu) (tedit 56C70E60) (tstamp 57C76197)
(at 136.66 109.796 180)
(path /57A213D7/57C783F2)
(fp_text reference P5 (at 0 -2.286 180) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TC2030-CTX (at 0 2.413 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_arc (start -4.445 2.54) (end -4.445 3.048) (angle 90) (layer F.CrtYd) (width 0.05))
(fp_arc (start 4.445 2.54) (end 4.953 2.54) (angle 90) (layer F.CrtYd) (width 0.05))
(fp_arc (start 4.445 -2.54) (end 4.445 -3.048) (angle 90) (layer F.CrtYd) (width 0.05))
(fp_arc (start -4.445 -2.54) (end -4.953 -2.54) (angle 90) (layer F.CrtYd) (width 0.05))
(fp_arc (start 2.794 -1.397) (end 2.794 -1.905) (angle 90) (layer F.CrtYd) (width 0.05))
(fp_arc (start 2.794 1.397) (end 3.302 1.397) (angle 90) (layer F.CrtYd) (width 0.05))
(fp_arc (start -2.54 0) (end -3.048 0.762) (angle 112.6198649) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.302 1.397) (end 3.302 -1.397) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.143 1.905) (end 2.794 1.905) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.048 0.762) (end -1.143 1.905) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.143 -1.905) (end -3.048 -0.762) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.794 -1.905) (end -1.143 -1.905) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.953 2.54) (end 4.953 -2.54) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.445 3.048) (end 4.445 3.048) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.953 -2.54) (end -4.953 2.54) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.445 -3.048) (end -4.445 -3.048) (layer F.CrtYd) (width 0.05))
(pad 1 smd circle (at -1.27 0.635 180) (size 0.762 0.762) (layers F.Cu F.Mask)
(net 1 +3V3) (solder_mask_margin 0.1))
(pad 2 smd circle (at -1.27 -0.635 180) (size 0.762 0.762) (layers F.Cu F.Mask)
(net 2 /mcu/TMS) (solder_mask_margin 0.1))
(pad 3 smd circle (at 0 0.635 180) (size 0.762 0.762) (layers F.Cu F.Mask)
(net 7 /mcu/nRESET) (solder_mask_margin 0.1))
(pad 4 smd circle (at 0 -0.635 180) (size 0.762 0.762) (layers F.Cu F.Mask)
(net 4 /mcu/TCK) (solder_mask_margin 0.1))
(pad 5 smd circle (at 1.27 0.635 180) (size 0.762 0.762) (layers F.Cu F.Mask)
(net 3 GND) (solder_mask_margin 0.1))
(pad "" np_thru_hole circle (at -2.54 0 180) (size 0.9 0.9) (drill 0.9) (layers *.Cu))
(pad "" np_thru_hole circle (at 2.54 1.016 180) (size 0.9 0.9) (drill 0.9) (layers *.Cu))
(pad "" np_thru_hole circle (at 2.54 -1.016 180) (size 0.9 0.9) (drill 0.9) (layers *.Cu))
(pad 6 smd circle (at 1.27 -0.635 180) (size 0.762 0.762) (layers F.Cu F.Mask)
(net 5 /mcu/TDO) (solder_mask_margin 0.1))
)
(module Capacitors_Tantalum_SMD:TantalC_SizeD_EIA-7343_Reflow (layer F.Cu) (tedit 555EF99E) (tstamp 57C958D9)
(at 104.11 63.44 90)
(descr "Tantal Cap. , Size D, EIA-7343, Reflow")
(tags "Tantal Capacitor Size-D EIA-7343 Reflow")
(path /57A213DE/57C963CF)
(attr smd)
(fp_text reference C34 (at -0.46 -3.21 90) (layer F.SilkS)
(fp_text value 15uF (at 0.34 0.09 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 4.6 -2.6) (end -4.6 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.6 -2.6) (end -4.6 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.6 2.6) (end 4.6 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.6 2.6) (end 4.6 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.2 2.2) (end 3.8 2.2) (layer F.SilkS) (width 0.15))
(fp_line (start 3.8 -2.2) (end -4.3 -2.2) (layer F.SilkS) (width 0.15))
(pad 2 smd rect (at 3.12 0 90) (size 2.37 2.43) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 1 smd rect (at -3.12 0 90) (size 2.37 2.43) (layers F.Cu F.Paste F.Mask)
(model Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeD_EIA-7343_Reflow.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 180))
)
)
(module Capacitors_Tantalum_SMD:TantalC_SizeD_EIA-7343_Reflow (layer F.Cu) (tedit 555EF99E) (tstamp 57C958E5)
(at 120.82 64.91 90)
(descr "Tantal Cap. , Size D, EIA-7343, Reflow")
(tags "Tantal Capacitor Size-D EIA-7343 Reflow")
(path /57A213DE/57C963D2)
(attr smd)
(fp_text reference C35 (at 5.31 1.78 360) (layer F.SilkS)
(fp_text value 220uF (at -0.19 -0.12 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 4.6 -2.6) (end -4.6 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.6 -2.6) (end -4.6 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.6 2.6) (end 4.6 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.6 2.6) (end 4.6 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.2 2.2) (end 3.8 2.2) (layer F.SilkS) (width 0.15))
(fp_line (start 3.8 -2.2) (end -4.3 -2.2) (layer F.SilkS) (width 0.15))
(pad 2 smd rect (at 3.12 0 90) (size 2.37 2.43) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 1 smd rect (at -3.12 0 90) (size 2.37 2.43) (layers F.Cu F.Paste F.Mask)
(model Capacitors_Tantalum_SMD.3dshapes/TantalC_SizeD_EIA-7343_Reflow.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 180))
)
)
(module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 5415D631) (tstamp 57C958F1)
(at 112.8 76.2 270)
(descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 0603")
(path /57A213DE/57C963C6)
(attr smd)
(fp_text reference C36 (at 3.1 0.2 450) (layer F.SilkS)
(fp_text value 10uF (at 0 0.1 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.45 -0.75) (end 1.45 -0.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.45 0.75) (end 1.45 0.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.45 -0.75) (end -1.45 0.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.45 -0.75) (end 1.45 0.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.35 -0.6) (end 0.35 -0.6) (layer F.SilkS) (width 0.15))
(fp_line (start 0.35 0.6) (end -0.35 0.6) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Capacitors_SMD.3dshapes/C_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 5415D631) (tstamp 57C958FD)
(at 122.6 82.01 180)
(descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
(tags "capacitor 0603")
(path /57A213DE/57C963C5)
(attr smd)
(fp_text reference C37 (at 0 -1.79 180) (layer F.SilkS)
(fp_text value 22uF (at -0.1 0.11 180) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.45 -0.75) (end 1.45 -0.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.45 0.75) (end 1.45 0.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.45 -0.75) (end -1.45 0.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.45 -0.75) (end 1.45 0.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.35 -0.6) (end 0.35 -0.6) (layer F.SilkS) (width 0.15))
(fp_line (start 0.35 0.6) (end -0.35 0.6) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.75 0 180) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 2 smd rect (at 0.75 0 180) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Capacitors_SMD.3dshapes/C_0603.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diodes_SMD:SMA_Standard (layer F.Cu) (tedit 552FF239) (tstamp 57C95912)
(at 115.93 63.8 90)
(descr "Diode SMA")
(tags "Diode SMA")
(path /57A213DE/57C963D6)
(attr smd)
(fp_text reference D10 (at 4.1 -0.03 180) (layer F.SilkS)
(fp_text value Schottky (at 0.3 -0.13 90) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.5 -2) (end 3.5 -2) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.5 -2) (end 3.5 2) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.5 2) (end -3.5 2) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.5 2) (end -3.5 -2) (layer F.CrtYd) (width 0.05))
(fp_text user K (at -2.9 2.95 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text user A (at 2.9 2.9 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 0.20066 -0.0508) (layer F.Adhes) (width 0.381))
(fp_line (start -1.79914 1.75006) (end -1.79914 1.39954) (layer F.SilkS) (width 0.15))
(fp_line (start -1.79914 -1.75006) (end -1.79914 -1.39954) (layer F.SilkS) (width 0.15))
(fp_line (start 2.25044 1.75006) (end 2.25044 1.39954) (layer F.SilkS) (width 0.15))
(fp_line (start -2.25044 1.75006) (end -2.25044 1.39954) (layer F.SilkS) (width 0.15))
(fp_line (start -2.25044 -1.75006) (end -2.25044 -1.39954) (layer F.SilkS) (width 0.15))
(fp_line (start 2.25044 -1.75006) (end 2.25044 -1.39954) (layer F.SilkS) (width 0.15))
(fp_line (start -2.25044 1.75006) (end 2.25044 1.75006) (layer F.SilkS) (width 0.15))
(fp_line (start -2.25044 -1.75006) (end 2.25044 -1.75006) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.99898 0 90) (size 2.49936 1.80086) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 1.99898 0 90) (size 2.49936 1.80086) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Diodes_SMD.3dshapes/SMA_Standard.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz 0 0 180))
)
)
(module Wurth_Inductor:PD2 (layer F.Cu) (tedit 56DFC874) (tstamp 57C9592A)
(at 123.7 78 90)
(descr "WE-PD2 SMD Power Inductor")
(tags Inductor)
(path /57A213DE/57C963CB)
(fp_text reference L5 (at 3.7 -2 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 10uH (at 0 0 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_arc (start 0 0) (end 0.9 2.6) (angle 38.1) (layer F.SilkS) (width 0.15))
(fp_line (start -0.9 -2.6) (end 0.9 -2.6) (layer F.SilkS) (width 0.15))
(fp_arc (start 0 0) (end -1.3 2.6) (angle 126.8698976) (layer F.CrtYd) (width 0.05))
(fp_arc (start 0 0) (end 1.3 -2.6) (angle 126.8698976) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 -2.6) (end 1.3 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.3 2.6) (end 1.3 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.9 2.6) (end 0.9 2.6) (layer F.SilkS) (width 0.15))
(fp_line (start -3 0.9) (end -3 -0.9) (layer F.SilkS) (width 0.15))
(fp_line (start 3 0.9) (end 3 -0.9) (layer F.SilkS) (width 0.15))
(fp_arc (start 0.003948 0.001363) (end -0.896052 -2.598637) (angle 38.1) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -1.925 0 180) (size 5.5 1.7) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 2 smd rect (at 1.925 0 180) (size 5.5 1.7) (layers F.Cu F.Paste F.Mask)
(model Inductors.3dshapes/SELF-WE-TPC_M.wrl
(at (xyz 0 0 0))
(scale (xyz 0.4 0.4 0.1))
(rotate (xyz 0 0 0))
)
)
(module CUI:PJ-102A (layer F.Cu) (tedit 57C9859A) (tstamp 57C9593E)
(at 129.27 63.96 180)
(descr PJ-102A)
(tags "CONN JACK")
(path /57A213DE/57C95843)
(fp_text reference P11 (at 0.17 3.06 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value ~ (at 0 3.1 360) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 4.9 -0.3) (end 4.9 13.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.4 -0.3) (end 4.9 -0.3) (layer F.CrtYd) (width 0.05))
(fp_line (start 2 8) (end 2 13.7) (layer F.SilkS) (width 0.15))
(fp_line (start -2 8) (end 2 8) (layer F.SilkS) (width 0.15))
(fp_line (start -2 13.7) (end -2 8) (layer F.SilkS) (width 0.15))
(fp_line (start 4.6 4.2) (end 4.6 13.7) (layer F.SilkS) (width 0.15))
(fp_line (start 4.6 0.1) (end 4.6 1.8) (layer F.SilkS) (width 0.15))
(fp_line (start 1.2 0.1) (end 4.6 0.1) (layer F.SilkS) (width 0.15))
(fp_line (start -4.4 0) (end -1.3 0) (layer F.SilkS) (width 0.15))
(fp_line (start -4.4 13.7) (end -4.4 0) (layer F.SilkS) (width 0.15))
(fp_line (start 4.6 13.7) (end -4.4 13.7) (layer F.SilkS) (width 0.15))
(fp_line (start -4.4 13.7) (end 4.9 13.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.4 -0.3) (end -4.4 13.7) (layer F.CrtYd) (width 0.05))
(pad 1 thru_hole oval (at 0 0 180) (size 2.1 1.5) (drill oval 1.6 1) (layers *.Cu *.Mask F.SilkS)
(pad 2 thru_hole oval (at 0 6 180) (size 2.1 1.5) (drill oval 1.6 1) (layers *.Cu *.Mask F.SilkS)
(net 3 GND) (zone_connect 2))
(pad 3 thru_hole oval (at 4.7 3 270) (size 2.1 1.5) (drill oval 1.6 1) (layers *.Cu *.Mask F.SilkS)
(model Connect.3dshapes/JACK_ALIM.wrl
(at (xyz 0 -0.25 0))
(scale (xyz 0.8 0.8 0.8))
(rotate (xyz 0 0 270))
)
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 54130A77) (tstamp 57C95955)
(at 111.05 63.97 90)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /57A213DE/57C963D8)
(attr smd)
(fp_text reference U14 (at 0 -3.5 90) (layer F.SilkS)
(fp_text value MIC4680-5.0 (at 2.07 0.05 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer F.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end -2.075 2.43) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
(fp_line (start -2.075 -2.43) (end -3.475 -2.43) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 2 smd rect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
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(pad 5 smd rect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 6 smd rect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module VSSOP:VSSOP-10_3.1x3.1mm_Pitch0.5mm (layer F.Cu) (tedit 56C5753E) (tstamp 57C95969)
(at 117.56 76.75)
(descr "10-Lead Plastic Small Outline Package")
(tags "VSSOP 0.5")
(path /57A213DE/57C963C7)
(attr smd)
(fp_text reference U15 (at 1.04 -2.25) (layer F.SilkS)
(fp_text value TPS62056 (at -0.06 -0.15) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.55 1.55) (end -1.55 1.55) (layer F.SilkS) (width 0.15))
(fp_line (start -2.45 -1.55) (end 1.55 -1.55) (layer F.SilkS) (width 0.15))
(fp_line (start -2.45 -1.55) (end 2.45 -1.55) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.45 -1.55) (end -2.45 1.55) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.45 1.55) (end -2.45 1.55) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.45 -1.55) (end 2.45 1.55) (layer F.CrtYd) (width 0.05))
(pad 1 smd rect (at -2.2 -1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at -2.2 -0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 3 smd rect (at -2.2 0) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 4 smd rect (at -2.2 0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 5 smd rect (at -2.2 1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 +3V3))
(pad 7 smd rect (at 2.2 0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 10 smd rect (at 2.2 -1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(pad 9 smd rect (at 2.2 -0.5) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at 2.2 0) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at 2.2 1) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 GND))
(model Housings_SSOP.3dshapes/MSOP-10-1EP_3x3mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 0.8))
(rotate (xyz 0 0 0))
)
)
(module BetaMachine:BetaMachine_Small (layer B.Cu) (tedit 0) (tstamp 57C99FF5)
(fp_text reference F4 (at 0 0 180) (layer B.SilkS) hide
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(effects (font (thickness 0.3)) (justify mirror))
)
(fp_text value BetaMachine (at 0.75 0 180) (layer B.SilkS) hide
(effects (font (thickness 0.3)) (justify mirror))
)
(fp_poly (pts (xy -9.172039 3.599233) (xy -8.834968 3.551598) (xy -8.527008 3.474201) (xy -8.248529 3.367202)
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