Newer
Older
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
* Filename: PRF947_SPICE.PRM
* PRF947.PRM SPICE MODEL OF BJT TYPE PRF947
* PHILIPS SEMICONDUCTORS
* Date : April 1997
* PACKAGE : SOT323 DIE MODEL : XB510
* 1: PACKED COLLECTOR; 2: PACKED BASE; 3: PACKED EMITTER;
.SUBCKT PRF947 1 2 3
Q1 6 5 7 7 XB510
* SOT323 parasitic model including bondpads
Lb 4 5 .6n
Le 7 8 .6n
L1 2 4 .34n
L2 1 6 .1n
L3 3 8 .34n
Ccb 4 6 100f
Cbe 4 8 2f
Cce 6 8 100f
Cbpb 5 6 83f
Cbpe 7 6 84f
* PHILIPS SEMICONDUCTORS Version: 1.0
* Filename: XB510.PRM Date: Feb 29 1996
* extracted batch 49917-4
.MODEL XB510 NPN
+ IS = 4.66E-16
+ BF = 150.4
+ NF = 1
+ VAF = 53.06
+ IKF = 0.18
+ ISE = 5.73E-14
+ NE = 2
+ BR = 27.68
+ NR = 1
+ VAR = 1.976
+ IKR = 0.009943
+ ISC = 1.42E-18
+ NC = 1
+ RB = 12.14
+ IRB = 0
+ RBM = 4.957
+ RE = 0.5974
+ RC = 1.988
+ CJE = 5.681E-13
+ VJE = 0.6
+ MJE = 0.4122
+ CJC = 2.058E-13
+ VJC = 0.2962
+ MJC = 0.118
+ CJS = 0
+ VJS = 0.7
+ MJS = 0
+ XCJC = 0.1042
+ TR = 0
+ TF = 2.037E-12
+ XTF = 30.9
+ VTF = 3.148
+ ITF = 0.1318
+ PTF = 0
+ FC = 0.9431
+ EG = 1.11
+ XTI = 3
+ AF = 1
+ KF = 4.00E-16
* Parameters with default value:
* XTB, EG, XTI, CJS, VJE, VJS and MJS.
* BONDPAD CAPS Cbpb=83E-15 Cbpe=84E-15 not included in model !
.END