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
      (net 40 /P21))
    (pad 5 thru_hole oval (at 0 5.08 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 43 /P24))
    (pad 6 thru_hole oval (at 2.54 5.08 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 42 /P23))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_2x03.wrl
      (at (xyz 0.05 -0.1 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )

  (module Pin_Headers:Pin_Header_Straight_2x06 (layer F.Cu) (tedit 0) (tstamp 57AA1BFC)
    (at 109.22 90.17 90)
    (descr "Through hole pin header")
    (tags "pin header")
    (path /57A595C3)
    (fp_text reference P2 (at -4.73 -2.82 270) (layer F.SilkS)
      (effects (font (size 1 1) (thickness 0.15)))
    )
    (fp_text value Keypad (at 1.07 6.57 180) (layer F.Fab)
      (effects (font (size 1 1) (thickness 0.15)))
    )
    (fp_line (start -1.75 -1.75) (end -1.75 14.45) (layer F.CrtYd) (width 0.05))
    (fp_line (start 4.3 -1.75) (end 4.3 14.45) (layer F.CrtYd) (width 0.05))
    (fp_line (start -1.75 -1.75) (end 4.3 -1.75) (layer F.CrtYd) (width 0.05))
    (fp_line (start -1.75 14.45) (end 4.3 14.45) (layer F.CrtYd) (width 0.05))
    (fp_line (start 3.81 13.97) (end 3.81 -1.27) (layer F.SilkS) (width 0.15))
    (fp_line (start -1.27 1.27) (end -1.27 13.97) (layer F.SilkS) (width 0.15))
    (fp_line (start 3.81 13.97) (end -1.27 13.97) (layer F.SilkS) (width 0.15))
    (fp_line (start 3.81 -1.27) (end 1.27 -1.27) (layer F.SilkS) (width 0.15))
    (fp_line (start 0 -1.55) (end -1.55 -1.55) (layer F.SilkS) (width 0.15))
    (fp_line (start 1.27 -1.27) (end 1.27 1.27) (layer F.SilkS) (width 0.15))
    (fp_line (start 1.27 1.27) (end -1.27 1.27) (layer F.SilkS) (width 0.15))
    (fp_line (start -1.55 -1.55) (end -1.55 0) (layer F.SilkS) (width 0.15))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
    (pad 2 thru_hole oval (at 2.54 0 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 2 +3V3))
    (pad 3 thru_hole oval (at 0 2.54 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 31 /P3))
    (pad 4 thru_hole oval (at 2.54 2.54 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 30 /P4))
    (pad 5 thru_hole oval (at 0 5.08 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 29 /P5))
    (pad 6 thru_hole oval (at 2.54 5.08 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 28 /P6))
    (pad 7 thru_hole oval (at 0 7.62 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 27 /P7))
    (pad 8 thru_hole oval (at 2.54 7.62 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 34 /P8))
    (pad 9 thru_hole oval (at 0 10.16 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 33 /P9))
    (pad 10 thru_hole oval (at 2.54 10.16 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 32 /P10))
    (pad 11 thru_hole oval (at 0 12.7 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 16 /P11))
    (pad 12 thru_hole oval (at 2.54 12.7 90) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 6 +5V))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_2x06.wrl
      (at (xyz 0.05 -0.25 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )

  (module Resistors_SMD:R_0603 (layer B.Cu) (tedit 5415CC62) (tstamp 57A91849)
    (at 113 105.6)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (path /57A213A5/57A89C41)
    (attr smd)
    (fp_text reference C3 (at -0.097 1.588) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 100nF (at 1.3 0.05) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.3 0.8) (end 1.3 0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.3 0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Resistors_SMD:R_0603 (layer B.Cu) (tedit 5415CC62) (tstamp 57A91827)
    (at 115.1 103.5 270)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (path /57A213A5/57A89C99)
    (attr smd)
    (fp_text reference C2 (at 0.2 -1.7 270) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 100nF (at -0.8 -0.05 270) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.3 0.8) (end 1.3 0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.3 0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.75 0 270) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 2 smd rect (at 0.75 0 270) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Resistors_SMD:R_0603 (layer B.Cu) (tedit 5415CC62) (tstamp 57A916F1)
    (at 127 114.554 270)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (path /57A213A9/57A88C4A)
    (attr smd)
    (fp_text reference C19 (at 0.127 -1.651 270) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 100nF (at -0.2 0.05 270) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.3 0.8) (end 1.3 0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.3 0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.75 0 270) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 2 smd rect (at 0.75 0 270) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Resistors_SMD:R_0603 (layer B.Cu) (tedit 5415CC62) (tstamp 57A916CF)
    (at 125.052541 117.538459 270)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (path /57A213A9/57A88F41)
    (attr smd)
    (fp_text reference C18 (at -0.05 -1.75 270) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 100nF (at 0.961541 -0.2 270) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.3 0.8) (end 1.3 0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.3 0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.75 0 270) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 2 smd rect (at 0.75 0 270) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Resistors_SMD:R_0603 (layer B.Cu) (tedit 5415CC62) (tstamp 57A7C2CC)
    (at 119.38 108.077)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (path /57A213A9/57A48196)
    (attr smd)
    (fp_text reference C21 (at 0.27 -1.577) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 12pF (at -0.025 0) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.3 0.8) (end 1.3 0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.3 0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 60 "Net-(C21-Pad1)"))
    (pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Resistors_SMD:R_0603 (layer B.Cu) (tedit 5415CC62) (tstamp 57A7C2EE)
    (at 116.713 110.617 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (path /57A213A9/57A48158)
    (attr smd)
    (fp_text reference C20 (at 0 -1.625 180) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 12pF (at 0 0.025 180) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.3 0.8) (end 1.3 0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.3 0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.75 0 180) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 61 "Net-(C20-Pad1)"))
    (pad 2 smd rect (at 0.75 0 180) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Resistors_SMD:R_0603 (layer B.Cu) (tedit 5415CC62) (tstamp 57A7C420)
    (at 112.821473 96.401522)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (path /57A213A5/57A4A717)
    (attr smd)
    (fp_text reference C8 (at 2.378527 -0.051522) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value C (at 0 -0.001522) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.3 0.8) (end 1.3 0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.3 0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.75 0) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 47 "Net-(C8-Pad1)"))
    (pad 2 smd rect (at 0.75 0) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Resistors_SMD:R_0603 (layer B.Cu) (tedit 5415CC62) (tstamp 57A7C442)
    (at 110.162285 94.138781 90)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (path /57A213A5/57A4A6C2)
    (attr smd)
    (fp_text reference C6 (at -2.311219 0.187715 270) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value C (at -0.011219 0.037715 90) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.3 0.8) (end 1.3 0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 -0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.3 0.8) (end -1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.3 0.8) (end 1.3 -0.8) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.5 -0.675) (end -0.5 -0.675) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.5 0.675) (end 0.5 0.675) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.75 0 90) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 59 "Net-(C6-Pad1)"))
    (pad 2 smd rect (at 0.75 0 90) (size 0.5 0.9) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module LGA_Packages:LGA-6-0.5mm (layer B.Cu) (tedit 57100005) (tstamp 57A7C636)
    (at 131.55 103.225)
    (path /57A213A4/570FFB99)
    (fp_text reference U4 (at 3.15 0.275) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value BALF-NRF01E3 (at -0.05 0.075) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -0.8 0.6) (end -0.8 -0.6) (layer B.SilkS) (width 0.05))
    (fp_line (start 0.8 0.6) (end 0.8 -0.6) (layer B.SilkS) (width 0.05))
    (fp_line (start 0.5 0.6) (end 0.8 0.6) (layer B.SilkS) (width 0.05))
    (fp_line (start -0.75 -0.5) (end -0.75 0.5) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.75 -0.5) (end -0.75 -0.5) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.75 0.5) (end 0.75 -0.5) (layer B.CrtYd) (width 0.05))
    (fp_line (start -0.75 0.5) (end 0.75 0.5) (layer B.CrtYd) (width 0.05))
    (pad 1 smd rect (at 0.5 0.3) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
      (net 46 "Net-(ANT2-Pad2)"))
    (pad 2 smd rect (at 0 0.3) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -0.5 0.3) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
      (net 62 "Net-(U3-Pad32)"))
    (pad 4 smd rect (at -0.5 -0.3) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
      (net 63 "Net-(U3-Pad31)"))
    (pad 5 smd rect (at 0 -0.3) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
      (net 64 "Net-(C29-Pad1)"))
    (pad 6 smd rect (at 0.5 -0.3) (size 0.2 0.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
  )

  (module Housings_DFN_QFN:UQFN-48-1EP_6x6mm_Pitch0.4mm (layer B.Cu) (tedit 54130A77) (tstamp 57A7C706)
    (at 126.988466 102.794)
    (descr "48-Lead Plastic Ultra Thin Quad Flat, No Lead Package (MV) - 6x6x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFN 0.4")
    (path /57A213A4/56BFA8C4)
    (attr smd)
    (fp_text reference U3 (at -0.115466 -4.242) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value nRF51822 (at -0.138466 -1.344) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -3.65 3.65) (end -3.65 -3.65) (layer B.CrtYd) (width 0.05))
    (fp_line (start 3.65 3.65) (end 3.65 -3.65) (layer B.CrtYd) (width 0.05))
    (fp_line (start -3.65 3.65) (end 3.65 3.65) (layer B.CrtYd) (width 0.05))
    (fp_line (start -3.65 -3.65) (end 3.65 -3.65) (layer B.CrtYd) (width 0.05))
    (fp_line (start 3.125 3.125) (end 3.125 2.525) (layer B.SilkS) (width 0.15))
    (fp_line (start -3.125 -3.125) (end -3.125 -2.525) (layer B.SilkS) (width 0.15))
    (fp_line (start 3.125 -3.125) (end 3.125 -2.525) (layer B.SilkS) (width 0.15))
    (fp_line (start -3.125 3.125) (end -2.525 3.125) (layer B.SilkS) (width 0.15))
    (fp_line (start -3.125 -3.125) (end -2.525 -3.125) (layer B.SilkS) (width 0.15))
    (fp_line (start 3.125 -3.125) (end 2.525 -3.125) (layer B.SilkS) (width 0.15))
    (fp_line (start 3.125 3.125) (end 2.525 3.125) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -3 2.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 2 smd rect (at -3 1.8) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 65 "Net-(U3-Pad2)"))
    (pad 3 smd rect (at -3 1.4) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 35 /P30))
    (pad 4 smd rect (at -3 1) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 36 /P0))
    (pad 5 smd rect (at -3 0.6) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 37 /P1))
    (pad 6 smd rect (at -3 0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 38 /P2))
    (pad 7 smd rect (at -3 -0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 31 /P3))
    (pad 8 smd rect (at -3 -0.6) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 30 /P4))
    (pad 9 smd rect (at -3 -1) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 29 /P5))
    (pad 10 smd rect (at -3 -1.4) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 28 /P6))
    (pad 11 smd rect (at -3 -1.8) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 27 /P7))
    (pad 12 smd rect (at -3 -2.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 13 smd rect (at -2.2 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 14 smd rect (at -1.8 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 34 /P8))
    (pad 15 smd rect (at -1.4 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 33 /P9))
    (pad 16 smd rect (at -1 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 32 /P10))
    (pad 17 smd rect (at -0.6 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 16 /P11))
    (pad 18 smd rect (at -0.2 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 17 /P12))
    (pad 19 smd rect (at 0.2 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 18 /P13))
    (pad 20 smd rect (at 0.6 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 19 /P14))
    (pad 21 smd rect (at 1 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 20 /P15))
    (pad 22 smd rect (at 1.4 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 21 /P16))
    (pad 23 smd rect (at 1.8 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 3 /mcu/SWDIO))
    (pad 24 smd rect (at 2.2 -3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 4 /mcu/SWDCLK))
    (pad 25 smd rect (at 3 -2.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 22 /P17))
    (pad 26 smd rect (at 3 -1.8) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 23 /P18))
    (pad 27 smd rect (at 3 -1.4) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 15 /P19))
    (pad 28 smd rect (at 3 -1) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 14 /P20))
    (pad 29 smd rect (at 3 -0.6) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 66 "Net-(C28-Pad1)"))
    (pad 30 smd rect (at 3 -0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 64 "Net-(C29-Pad1)"))
    (pad 31 smd rect (at 3 0.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 63 "Net-(U3-Pad31)"))
    (pad 32 smd rect (at 3 0.6) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 62 "Net-(U3-Pad32)"))
    (pad 33 smd rect (at 3 1) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 34 smd rect (at 3 1.4) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 35 smd rect (at 3 1.8) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 36 smd rect (at 3 2.2) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 37 smd rect (at 2.2 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 39 "Net-(C26-Pad2)"))
    (pad 38 smd rect (at 1.8 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 67 "Net-(C25-Pad2)"))
    (pad 39 smd rect (at 1.4 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 68 "Net-(C24-Pad2)"))
    (pad 40 smd rect (at 1 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 40 /P21))
    (pad 41 smd rect (at 0.6 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 41 /P22))
    (pad 42 smd rect (at 0.2 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 42 /P23))
    (pad 43 smd rect (at -0.2 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 43 /P24))
    (pad 44 smd rect (at -0.6 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 12 /P25))
    (pad 45 smd rect (at -1 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 13 /P26))
    (pad 46 smd rect (at -1.4 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 24 /P27))
    (pad 47 smd rect (at -1.8 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 25 /P28))
    (pad 48 smd rect (at -2.2 3 270) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask)
      (net 26 /P29))
    (pad 49 smd rect (at 1.66875 -1.66875) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at 1.66875 -0.55625) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at 1.66875 0.55625) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at 1.66875 1.66875) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at 0.55625 -1.66875) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at 0.55625 -0.55625) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at 0.55625 0.55625) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at 0.55625 1.66875) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at -0.55625 -1.66875) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at -0.55625 -0.55625) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at -0.55625 0.55625) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at -0.55625 1.66875) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at -1.66875 -1.66875) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at -1.66875 -0.55625) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at -1.66875 0.55625) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 49 smd rect (at -1.66875 1.66875) (size 1.1125 1.1125) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_DFN_QFN.3dshapes/UQFN-48-1EP_6x6mm_Pitch0.4mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Housings_DFN_QFN:QFN-32-1EP_5x5mm_Pitch0.5mm (layer B.Cu) (tedit 54130A77) (tstamp 57A7C7D5)
    (at 111.2825 100.4805 90)
    (descr "UH Package; 32-Lead Plastic QFN (5mm x 5mm); (see Linear Technology QFN_32_05-08-1693.pdf)")
    (tags "QFN 0.5")
    (path /57A213A5/57A4BD6F)
    (attr smd)
    (fp_text reference U1 (at 1.9305 3.7675 90) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value PN512 (at 0.0805 0.0675 90) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -3 3) (end -3 -3) (layer B.CrtYd) (width 0.05))
    (fp_line (start 3 3) (end 3 -3) (layer B.CrtYd) (width 0.05))
    (fp_line (start -3 3) (end 3 3) (layer B.CrtYd) (width 0.05))
    (fp_line (start -3 -3) (end 3 -3) (layer B.CrtYd) (width 0.05))
    (fp_line (start 2.625 2.625) (end 2.625 2.1) (layer B.SilkS) (width 0.15))
    (fp_line (start -2.625 -2.625) (end -2.625 -2.1) (layer B.SilkS) (width 0.15))
    (fp_line (start 2.625 -2.625) (end 2.625 -2.1) (layer B.SilkS) (width 0.15))
    (fp_line (start -2.625 2.625) (end -2.1 2.625) (layer B.SilkS) (width 0.15))
    (fp_line (start -2.625 -2.625) (end -2.1 -2.625) (layer B.SilkS) (width 0.15))
    (fp_line (start 2.625 -2.625) (end 2.1 -2.625) (layer B.SilkS) (width 0.15))
    (fp_line (start 2.625 2.625) (end 2.1 2.625) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -2.4 1.75 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -2.4 1.25 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 3 smd rect (at -2.4 0.75 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 4 smd rect (at -2.4 0.25 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -2.4 -0.25 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 6 smd rect (at -2.4 -0.75 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 36 /P0))
    (pad 7 smd rect (at -2.4 -1.25 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(TP2-Pad1)"))
    (pad 8 smd rect (at -2.4 -1.75 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(TP1-Pad1)"))
    (pad 9 smd rect (at -1.75 -2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 10 smd rect (at -1.25 -2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at -0.75 -2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 52 "Net-(L2-Pad1)"))
    (pad 12 smd rect (at -0.25 -2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 57 "Net-(C5-Pad2)"))
    (pad 13 smd rect (at 0.25 -2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(L3-Pad1)"))
    (pad 14 smd rect (at 0.75 -2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 15 smd rect (at 1.25 -2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 16 smd rect (at 1.75 -2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 58 "Net-(C10-Pad2)"))
    (pad 17 smd rect (at 2.4 -1.75 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 51 "Net-(C9-Pad2)"))
    (pad 18 smd rect (at 2.4 -1.25 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 19 smd rect (at 2.4 -0.75 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 69 "Net-(U1-Pad19)"))
    (pad 20 smd rect (at 2.4 -0.25 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 70 "Net-(U1-Pad20)"))
    (pad 21 smd rect (at 2.4 0.25 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 59 "Net-(C6-Pad1)"))
    (pad 22 smd rect (at 2.4 0.75 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 47 "Net-(C8-Pad1)"))
    (pad 23 smd rect (at 2.4 1.25 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 38 /P2))
    (pad 24 smd rect (at 2.4 1.75 90) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 37 /P1))
    (pad 25 smd rect (at 1.75 2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 26 smd rect (at 1.25 2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 27 smd rect (at 0.75 2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 28 smd rect (at 0.25 2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 29 smd rect (at -0.25 2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 26 /P29))
    (pad 30 smd rect (at -0.75 2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 25 /P28))
    (pad 31 smd rect (at -1.25 2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 24 /P27))
    (pad 32 smd rect (at -1.75 2.4) (size 0.7 0.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 33 smd rect (at 0.8625 -0.8625 90) (size 1.725 1.725) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at 0.8625 0.8625 90) (size 1.725 1.725) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at -0.8625 -0.8625 90) (size 1.725 1.725) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at -0.8625 0.8625 90) (size 1.725 1.725) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_DFN_QFN.3dshapes/QFN-32-1EP_5x5mm_Pitch0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 57A7C867)
    (at 128.5 108.925 90)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (path /57A213A4/56BFA8BB)
    (attr smd)
    (fp_text reference C24 (at -0.375 -1.35 90) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 100nF (at 0.725 -0.05 90) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 68 "Net-(C24-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 57A7C889)
    (at 122.7 99.3 90)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (path /57A213A4/56BFA8AB)
    (attr smd)
    (fp_text reference C23 (at 0 -1.35 90) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 100nF (at -0.7 -0.15 90) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 57A7C8AB)
    (at 129.70043 111.294057 90)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (path /57A213A4/56BFA8BD)
    (attr smd)
    (fp_text reference C25 (at -0.338943 -1.30343 90) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 12pF (at -0.655943 -0.00043 90) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 67 "Net-(C25-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 57A7C8CD)
    (at 131.715684 108.394919 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (path /57A213A4/56BFA8BE)
    (attr smd)
    (fp_text reference C26 (at -2.684316 0.094919 180) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 12pF (at -0.184316 -0.105081 180) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 39 "Net-(C26-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 57A7C8EF)
    (at 131.3 104.925 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (path /57A213A4/56BFA8BA)
    (attr smd)
    (fp_text reference C27 (at 0.625 -2.95 270) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 1nF (at 0.375 -0.15 270) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 57A7C911)
    (at 122.7 105.775 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (path /57A213A4/56BFA8C2)
    (attr smd)
    (fp_text reference C22 (at -2.625 0.2 270) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 100nF (at 0.025 0.2 270) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 57A7C933)
    (at 132.45 100.35 90)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (path /57A213A4/56BFA8AE)
    (attr smd)
    (fp_text reference C28 (at 0.35 3 90) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 47nF (at 0.75 0.05 90) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 66 "Net-(C28-Pad1)"))
    (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Capacitors_SMD:C_0402 (layer B.Cu) (tedit 5415D599) (tstamp 57A7C955)
    (at 132.55 102.125)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (path /57A213A4/56BFA8B7)
    (attr smd)
    (fp_text reference C29 (at 2.7 0.075) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 2.2nF (at 0.3 -0.075) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.15 0.6) (end 1.15 0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 -0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.15 0.6) (end -1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.15 0.6) (end 1.15 -0.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 0.25 0.475) (end -0.25 0.475) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.25 -0.475) (end 0.25 -0.475) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 64 "Net-(C29-Pad1)"))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Abracon:ABM8G (layer B.Cu) (tedit 56F3EB4E) (tstamp 57A7C97B)
    (at 131.855837 110.998625 90)
    (path /57A213A4/56C251A9)
    (fp_text reference Y1 (at 0.098625 2.144163 270) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 32MHz (at -1.301375 0.094163 90) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.7 -0.15) (end -1.7 0.15) (layer B.SilkS) (width 0.15))
    (fp_line (start 0.3 -1.35) (end -0.3 -1.35) (layer B.SilkS) (width 0.15))
    (fp_line (start 1.7 0.15) (end 1.7 -0.15) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.3 1.35) (end 0.3 1.35) (layer B.SilkS) (width 0.15))
    (fp_line (start -1.6 -1.25) (end -1.6 1.25) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.6 -1.25) (end -1.6 -1.25) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.6 1.25) (end 1.6 -1.25) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.6 1.25) (end 1.6 1.25) (layer B.CrtYd) (width 0.05))
    (pad 3 smd rect (at -1.1 0.85 90) (size 1.4 1.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 1.1 0.85 90) (size 1.4 1.2) (layers B.Cu B.Paste B.Mask)
      (net 39 "Net-(C26-Pad2)"))
    (pad 3 smd rect (at 1.1 -0.85 90) (size 1.4 1.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 -0.85 90) (size 1.4 1.2) (layers B.Cu B.Paste B.Mask)
      (net 67 "Net-(C25-Pad2)"))
    (model /Users/nipo/projects/hardware/kicad-library/Abracon.3dshapes/ABM8G.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz -90 0 0))
    )
  )

  (module Housings_DFN_QFN:QFN-28-1EP_6x6mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 57A8FC20)
    (at 121.730073 112.646549 180)
    (descr "28-Lead Plastic Quad Flat, No Lead Package (ML) - 6x6 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFN 0.65")
    (path /57A213A9/57A5BF64)
    (attr smd)
    (fp_text reference U2 (at -0.316927 4.373549 180) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value MCP25625/QFN (at 2.430073 -0.053451 180) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -3.6 3.6) (end -3.6 -3.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 3.6 3.6) (end 3.6 -3.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -3.6 3.6) (end 3.6 3.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start -3.6 -3.6) (end 3.6 -3.6) (layer B.CrtYd) (width 0.05))
    (fp_line (start 3.15 3.15) (end 3.15 2.36) (layer B.SilkS) (width 0.15))
    (fp_line (start -3.15 -3.15) (end -3.15 -2.36) (layer B.SilkS) (width 0.15))
    (fp_line (start 3.15 -3.15) (end 3.15 -2.36) (layer B.SilkS) (width 0.15))
    (fp_line (start -3.15 3.15) (end -2.36 3.15) (layer B.SilkS) (width 0.15))
    (fp_line (start -3.15 -3.15) (end -2.36 -3.15) (layer B.SilkS) (width 0.15))
    (fp_line (start 3.15 -3.15) (end 2.36 -3.15) (layer B.SilkS) (width 0.15))
    (fp_line (start 3.15 3.15) (end 2.36 3.15) (layer B.SilkS) (width 0.15))
    (pad 1 smd rect (at -2.85 1.95 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 13 /P26))
    (pad 2 smd rect (at -2.85 1.3 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 12 /P25))
    (pad 3 smd rect (at -2.85 0.65 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 4 smd rect (at -2.85 0 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(TP3-Pad1)"))
    (pad 5 smd rect (at -2.85 -0.65 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(TP4-Pad1)"))
    (pad 6 smd rect (at -2.85 -1.3 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 71 "Net-(U2-Pad6)"))
    (pad 7 smd rect (at -2.85 -1.95 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 72 "Net-(U2-Pad7)"))
    (pad 8 smd rect (at -1.95 -2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 73 "Net-(U2-Pad8)"))
    (pad 9 smd rect (at -1.3 -2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 74 "Net-(U2-Pad9)"))
    (pad 10 smd rect (at -0.65 -2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(TP4-Pad1)"))
    (pad 11 smd rect (at 0 -2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 2 +3V3))
    (pad 12 smd rect (at 0.65 -2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 78 "Net-(P4-Pad3)"))
    (pad 13 smd rect (at 1.3 -2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 79 "Net-(P4-Pad2)"))
    (pad 14 smd rect (at 1.95 -2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask))
    (pad 15 smd rect (at 2.85 -1.95 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 16 smd rect (at 2.85 -1.3 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(TP3-Pad1)"))
    (pad 17 smd rect (at 2.85 -0.65 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask))
    (pad 18 smd rect (at 2.85 0 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 19 smd rect (at 2.85 0.65 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 6 +5V))
    (pad 20 smd rect (at 2.85 1.3 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 61 "Net-(C20-Pad1)"))
    (pad 21 smd rect (at 2.85 1.95 180) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 60 "Net-(C21-Pad1)"))
    (pad 22 smd rect (at 1.95 2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 23 smd rect (at 1.3 2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 75 "Net-(U2-Pad23)"))
    (pad 24 smd rect (at 0.65 2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 76 "Net-(U2-Pad24)"))
    (pad 25 smd rect (at 0 2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 35 /P30))
    (pad 26 smd rect (at -0.65 2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 26 /P29))
    (pad 27 smd rect (at -1.3 2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 25 /P28))
    (pad 28 smd rect (at -1.95 2.85 90) (size 1 0.37) (layers B.Cu B.Paste B.Mask)
      (net 24 /P27))
    (pad 29 smd rect (at 1.59375 -1.59375 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at 1.59375 -0.53125 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at 1.59375 0.53125 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at 1.59375 1.59375 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at 0.53125 -1.59375 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at 0.53125 -0.53125 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at 0.53125 0.53125 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at 0.53125 1.59375 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at -0.53125 -1.59375 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at -0.53125 -0.53125 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at -0.53125 0.53125 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at -0.53125 1.59375 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at -1.59375 -1.59375 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at -1.59375 -0.53125 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at -1.59375 0.53125 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (pad 29 smd rect (at -1.59375 1.59375 180) (size 1.0625 1.0625) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_DFN_QFN.3dshapes/QFN-28-1EP_6x6mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )

  (module Abracon:ABM8G (layer B.Cu) (tedit 56F3EB4E) (tstamp 57A8FDF7)
    (at 116.586 107.95 90)
    (path /57A213A9/57A48096)
    (fp_text reference X2 (at 2.413 0.762 180) (layer B.SilkS)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_text value 16MHz (at -0.025 -3.45 180) (layer B.Fab)
      (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
    )
    (fp_line (start -1.7 -0.15) (end -1.7 0.15) (layer B.SilkS) (width 0.15))
    (fp_line (start 0.3 -1.35) (end -0.3 -1.35) (layer B.SilkS) (width 0.15))
    (fp_line (start 1.7 0.15) (end 1.7 -0.15) (layer B.SilkS) (width 0.15))
    (fp_line (start -0.3 1.35) (end 0.3 1.35) (layer B.SilkS) (width 0.15))
    (fp_line (start -1.6 -1.25) (end -1.6 1.25) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.6 -1.25) (end -1.6 -1.25) (layer B.CrtYd) (width 0.05))
    (fp_line (start 1.6 1.25) (end 1.6 -1.25) (layer B.CrtYd) (width 0.05))
    (fp_line (start -1.6 1.25) (end 1.6 1.25) (layer B.CrtYd) (width 0.05))
    (pad 3 smd rect (at -1.1 0.85 90) (size 1.4 1.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 1.1 0.85 90) (size 1.4 1.2) (layers B.Cu B.Paste B.Mask)
      (net 60 "Net-(C21-Pad1)"))
    (pad 3 smd rect (at 1.1 -0.85 90) (size 1.4 1.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 -0.85 90) (size 1.4 1.2) (layers B.Cu B.Paste B.Mask)
      (net 61 "Net-(C20-Pad1)"))
    (model /Users/nipo/projects/hardware/kicad-library/Abracon.3dshapes/ABM8G.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz -90 0 0))
    )
  )
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